芯片硅整流

SFM11 -M THRU SFM18 -M

名单

台塑MS

List................................................................................................. 1

封装外形................................................ ............................... 2

功能................................................. ......................................... 2

机械数据................................................ ............................... 2

最大额定值................................................ ............................. 2

评级和特性曲线.............................................. .......... 3

管脚信息................................................ ........................... 4

标记................................................. .......................................... 4

建议焊盘布局.............................................. ............... 4

包装信息................................................ .......................... 5

卷筒包装................................................ .................................... 6

建议隔热型材的焊接工艺............................. 6

高可靠性的测试能力.............................................. ............. 7

http://www.formosams.com/

电话： 886-2-22696661

传真： 886-2-22696141

文档ID

ISSUED DATE

2008/02/10

修改日期

2010/03/10

调整

D

页。

7

第1页

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