ZMD31020
传感器信号调理器
数据表
内容
引脚说明......................................................................................................................................3
电路描述.............................................................................................................................4
2.1信号流....................................................................................................................................................4
2.2配置Word........................................................................................................................................5
2.3
差动传感器....................................................................................................................................5
2.4
温度传感...............................................................................................................................5
2.5
模拟量输入通道...............................................................................................................................6
2.5.1
大桥极性设置.......................................................................................................................6
2.5.2
可编程增益放大器PGA...................................................................................................6
2.5.3
模拟 - 数字转换器ADC的.......................................................................................................6
2.5.4
温度测量...............................................................................................................7
2.6
校正微控制器CMC................................................................................................................7
2.7
参数EEPROM.................................................................................................................................7
2.8
传感器信号校正方法和序列............................................ ......................................... 8
2
2.9
数字I 2 C接口...................................................................................................................................8
2.9.1
数字校正的传感器信号输出和I / O校准和设备测试............................. 8
2.9.2
数据通信Specifics..........................................................................................................8
2.10
模拟输出Stage....................................................................................................................10
3.
电气SPECIFICATION.................................................................................................................10
3.1
绝对最大ratings......................................................................................................................10
3.2
工作条件..............................................................................................................................10
3.3
电动Parameters..............................................................................................................................11
3.3.1
动力Supply...................................................................................................................................11
3.3.2
PGA & 12位ADC的输入..................................................................................................................11
(4)
3.3.3
温度测量：电流源，片内二极管& 12位ADC .............................. 11
(1)
3.3.4
12位ADC ...................................................................................................................................12
3.3.5
EEPROM编程...................................................................................................................12
2
3.3.6
串行I C Interface...........................................................................................................................12
(2)
3.3.7
11位输出DAC &输出缓冲器.......................................... ............................................... 14
3.3.8
系统总....................................................................................................................................14
4.
包装尺寸..........................................................................................................................15
5.
DIE尺寸和PAD坐标............................................. ............................................ 16
5.1
模具尺寸.......................................................................................................................................16
5.2
垫坐标.....................................................................................................................................17
6.
评估套件“ ZMD31020KIT ” ...........................................................................................................18
7.
订购信息......................................................................................................................19
8.
相关DOCUMENTS...........................................................................................................................19
1.
2.
2004 ， ZMD AG，牧师1.6 ， 2005-05-19
2/19
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