目录
1订购部件............................................... ............................ 3
1.1确定有效的可订购的零件...................................... 3
第2部分鉴定............................................... ....................... 3
2.1说明................................................ ......................... 3
2.2格式................................................ ............................... 3
2.3场................................................ ................................. 3
2.4示例................................................ ............................ 4
3参数分类............................................... ............ 4
4等级................................................ ...................................... 4
4.1热装卸评级.............................................. 4 .....
4.2水分处理等级.............................................. 5 ....
4.3 ESD处理等级.............................................. 5 ...........
4.4电压和电流的操作评级............................... 5
5一般................................................ ..................................... 6
5.1非开关电气规范............................... 6
5.1.1
5.1.2
5.1.3
直流特性................................................ 0.6
电源电流特性............................... 11
EMC性能................................................ 0.12
5.2开关规格............................................... ...... 12
5.2.1
5.2.2
5.2.3
控制时间................................................ ........ 12
调试跟踪定时规范......................... 13
FTM模块时序............................................... 14
5.3散热规范............................................... ........ 15
5.3.1
热特性......................................... 15
6外设的操作要求和行为.................... 16
6.1外部振荡器（ XOSC ）和ICS的特点........... 16
6.2 NVM规格............................................... ............. 18
6.3模拟................................................ ............................... 19
6.3.1
6.3.2
ADC特性............................................... 19
模拟比较器（ ACMP ） ELECTRICALS ................. 22
7尺寸................................................ ............................... 23
7.1获取封装尺寸......................................... 23
8引脚................................................ ........................................ 23
8.1信号复用和引脚分配........................... 23
8.2器件引脚分配.............................................. ........ 24
9修订历史............................................... .......................... 25
MC9S08PA4系列数据手册，第2版，二○一二年十二月二十零日。
2
飞思卡尔半导体公司
QQ：2880707522 复制
