ISD2532/40/48/64
4.目录
1.一般DESCRIPTION.................................................................................................................. 2
2.特点......................................................................................................................................... 2
3.框图.............................................................................................................................. 3
4.目录...................................................................................................................... 4
5.引脚配置.......................................................................................................................五
6.引脚说明............................................................................................................................. 6
7.功能DESCRIPTION.......................................................................................................... 10
7.1 。详细Description.................................................................................................................... 10
7.2 。操作模式..................................................................................................................... 11
7.2.1 。操作模式Description............................................................................................ 12
8.时序DIAGRAMS.......................................................................................................................... 16
9.绝对最大RATINGS.................................................................................................... 19
9.1工作条件................................................................................................................... 20
10.电气特性.............................................. ................................................. 21
10.1 。参数为封装器件.............................................. ................................................ 21
10.1.1 。典型的参数变化与电压和温度 - 封装器件................ 24
10.2 。参数对模.................................................................................................................. 25
10.2.1 。典型的参数变化与电压和温度 - 模具.................................... 28
10.3 。参数通过按钮进行模式............................................ .............................................. 29
11.典型应用电路图............................................. .................................................. 30 ..
12.包装图和尺寸............................................ ........................................ 35
12.1 。 28引脚300mil的塑料小外形集成电路（ SOIC ） ..................................... ................................ 35
12.2 。 28引脚600密耳厚的塑料双列直插式封装（ PDIP ） ..................................... .......................... 36
12.3 。 28引脚8x13.4MM塑料薄型小尺寸封装（ TSOP ）型1 ................................ 37
12.4 。芯片焊接物理布局
[1]
................................................................................................ 38
14.版本历史....................................................................................................................... 41
-4-
QQ：2880707522 复制
