GSM25DSXS详细规格
- 类别:Card Edge, Edgeboard Connectors
- 描述:CONN EDGECARD 50POS DIP .156 SLD
- 系列:-
- 制造商:Sullins Connector Solutions
- 卡类型:非指定 - 双边
- 公母:母头
- 位/盘/排数:25
- 针脚数:50
- 卡厚度:0.062"(1.57mm)
- 排数:2
- 间距:0.156"(3.96mm)
- 特性:-
- 安装类型:通孔
- 端接:焊接
- 触头材料:磷青铜
- 触头镀层:金
- 触头镀层厚度:10µin(0.25µm)
- 触头类型:全波纹管
- 颜色:黑
- 包装:托盘
- 法兰特性:侧面安装开口,无螺纹,0.125"(3.18mm)直径
- 存储器 IDT, Integrated Device Technology Inc 52-LCC(J 形引线) IC SRAM 16KBIT 55NS 52PLCC
- Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps Texas Instruments TO-99-8 金属罐 IC OP AMP DUAL HIGH TEMP TO-99-8
- Card Edge, Edgeboard Connectors Sullins Connector Solutions CONN EDGECARD 50POS .156 EXTEND
- 溫度 Texas Instruments SC-74A,SOT-753 IC THERMOSTAT PRESET SOT23-5
- 嵌入式 - 微控制器, Microchip Technology 100-TQFP IC DSPIC MCU/DSP 64K 100TQFP
- Card Edge, Edgeboard Connectors Sullins Connector Solutions CONN EDGECARD 16POS DIP .100 SLD
- 逻辑 - FIFO IDT, Integrated Device Technology Inc 144-BGA IC FIFO SS 4096X36 7-5NS 144BGA
- 时钟/计时 - 实时时钟 Maxim Integrated 34-PowerCap? 模块 IC RTC RAM Y2K 3.3V 120NS 34PCM
- 存储器 IDT, Integrated Device Technology Inc 52-LCC(J 形引线) IC SRAM 16KBIT 55NS 52PLCC
- 溫度 Texas Instruments SC-74A,SOT-753 IC THERMOSTAT PRESET SOT23-5
- 嵌入式 - 微控制器, Microchip Technology 100-TQFP IC DSPIC MCU/DSP 64K 100-TQFP
- Card Edge, Edgeboard Connectors Sullins Connector Solutions CONN EDGECARD 16POS DIP .100 SLD
- 时钟/计时 - 实时时钟 Maxim Integrated 34-PowerCap? 模块 IC RTC RAM Y2K 3.3V 120NS 34PCM
- 存储器 IDT, Integrated Device Technology Inc 68-BPGA IC SRAM 32KBIT 25NS 68PGA
- 逻辑 - FIFO IDT, Integrated Device Technology Inc 120-LQFP IC FIFO 8192X36 10NS 120QFP