GSM25DSEI-S13 全国供应商、价格、PDF资料
GSM25DSEI-S13详细规格
- 类别:Card Edge, Edgeboard Connectors
- 描述:CONN EDGECARD 50POS .156 EXTEND
- 系列:-
- 制造商:Sullins Connector Solutions
- 卡类型:非指定 - 双边
- 公母:母头
- 位/盘/排数:25
- 针脚数:50
- 卡厚度:0.062"(1.57mm)
- 排数:2
- 间距:0.156"(3.96mm)
- 特性:卡扩展器
- 安装类型:板边缘,跨骑式安装
- 端接:焊接孔眼
- 触头材料:磷青铜
- 触头镀层:金
- 触头镀层厚度:10µin(0.25µm)
- 触头类型:全波纹管
- 颜色:黑
- 包装:托盘
- 法兰特性:顶部安装开口,螺纹插件,4-40
- 时钟/计时 - 实时时钟 Maxim Integrated 32-DIP 模块(0.600",15.24mm) IC RTC RAM Y2K 3.3V 120NS 32EDIP
- 存储器 IDT, Integrated Device Technology Inc 52-LCC(J 形引线) IC SRAM 16KBIT 100NS 52PLCC
- Card Edge, Edgeboard Connectors Sullins Connector Solutions CONN EDGECARD 50POS R/A .156 SLD
- 嵌入式 - 微控制器, Microchip Technology 64-VFQFN 裸露焊盘 IC DSPIC MCU/DSP 64K 64-QFN
- PMIC - 稳压器 - DC DC 开关稳压器 Texas Instruments * IC REG BOOST FLYBACK SEPIC 8MSOP
- Card Edge, Edgeboard Connectors Sullins Connector Solutions CONN EDGECARD 16POS DIP .100 SLD
- 逻辑 - FIFO IDT, Integrated Device Technology Inc 128-LQFP IC FIFO SS 4096X36 15NS 128-TQFP
- 时钟/计时 - 实时时钟 Maxim Integrated 32-DIP 模块(0.600",15.24mm) IC RTC RAM Y2K 3.3V 120NS 32EDIP
- 存储器 IDT, Integrated Device Technology Inc 52-LCC(J 形引线) IC SRAM 16KBIT 55NS 52PLCC
- 溫度 Texas Instruments SC-74A,SOT-753 IC THERMOSTAT PRESET SOT23-5
- 嵌入式 - 微控制器, Microchip Technology 100-TQFP IC DSPIC MCU/DSP 64K 100TQFP
- Card Edge, Edgeboard Connectors Sullins Connector Solutions CONN EDGECARD 16POS DIP .100 SLD
- 逻辑 - FIFO IDT, Integrated Device Technology Inc 144-BGA IC FIFO SS 4096X36 7-5NS 144BGA
- 时钟/计时 - 实时时钟 Maxim Integrated 34-PowerCap? 模块 IC RTC RAM Y2K 3.3V 120NS 34PCM
- 存储器 IDT, Integrated Device Technology Inc 52-LCC(J 形引线) IC SRAM 16KBIT 55NS 52PLCC