2058301-1详细规格
- 类别:矩形 - 触点
- 描述:CONN BLADE CONTACT 18-22AWG TIN
- 系列:-
- 制造商:TE Connectivity
- 类型:-
- 引脚或插座:刀片
- 触头端接:压接
- 线规:18-22 AWG
- 触头镀层:锡
- 触头镀层厚度:-
- 包装:剪切带 (CT)
2058301-1详细规格
- 类别:矩形 - 触点
- 描述:CONN BLADE CONTACT 18-22AWG TIN
- 系列:-
- 制造商:TE Connectivity
- 类型:-
- 引脚或插座:刀片
- 触头端接:压接
- 线规:18-22 AWG
- 触头镀层:锡
- 触头镀层厚度:-
- 包装:带卷 (TR)
- 用于 IC 的插座,晶体管 TE Connectivity SOT-23-6 CONN SOCKET 16POS SIP VERT GOLD
- 单二极管/齐纳 ON Semiconductor DO-214AA,SMB DIODE ZENER 7.5V 3W SMB
- 矩形 - 触点 TE Connectivity DO-214AA,SMB CONN BLADE CONTACT 18-22AWG TIN
- 电容器 Rubycon 径向,Can CAP ALUM 5.6UF 200V 20% RADIAL
- 光纤 TE Connectivity 径向,Can CA, 1.8MM, ZIP OFNP, LC-LC(XG)
- 光纤 TE Connectivity 径向,Can CA,50,MTRJ-MTRJ
- 存储器 Microchip Technology 8-DIP(0.300",7.62mm) IC EEPROM 4KBIT 10MHZ 8DIP
- 存储器 - 直插式模块插口 TE Connectivity 8-DIP(0.300",7.62mm) DDR II DIMM 240 POS ASSEMBLY
- 配件 Vicor Corporation 8-DIP(0.300",7.62mm) STANDOFF KIT THREADED
- 电容器 Rubycon 径向,Can CAP ALUM 6.8UF 200V 20% RADIAL
- 光纤 TE Connectivity 径向,Can C/A,1.8MM,ZIP RIS,LC-LC(XG)
- 光纤 TE Connectivity 径向,Can CA,50,MTRJ-MTRJ
- 光纤 TE Connectivity 径向,Can C/A, MT-RJ TO SC DUPLEX XG FI
- 存储器 Microchip Technology 8-SOIC(0.154",3.90mm 宽) IC EEPROM 4KBIT 10MHZ 8SOIC
- 配件 Vicor Corporation 8-SOIC(0.154",3.90mm 宽) STANDOFF KIT THREADED