1565691-1详细规格
- 类别:存储器 - 直插式模块插口
- 描述:CONN MEMORY SOCKET 200POS GOLD
- 系列:-
- 制造商:TE Connectivity
- 连接器样式:SODIMM
- 针脚数:200
- 存储器类型:DDR SDRAM
- 标准:-
- 安装类型:表面贴装,直角
- 特性:板导轨,锁存器
- 安装特性:标准
- 包装:托盘
- 触头镀层:金
- 触头镀层厚度:闪光
- 陶瓷 Vishay BC Components 径向,圆盘 CAP CER 150PF 1KV 10% RADIAL
- 矩形- 接头,公引脚 TE Connectivity 径向,圆盘 CONN RECEPT 14POS VERT TIN 2.5MM
- 箱 Hammond Manufacturing 径向,圆盘 BOX ABS 4.19X2.60X1.79" BLACK
- 接地垫 3M 径向,圆盘 FLOOR TILE DISSP GRN 0.125 X12"
- 模块 - 插孔 TE Connectivity 径向,圆盘 CONN MOD JACK R/A 8P8C SHIELDED
- 面板至面板 - 面板衬垫,堆叠器 TE Connectivity 径向,圆盘 CONN HEADR 30POS .100" DUAL ROW
- 灯 - 白炽灯,氖灯 JKL Components Corp. 径向,圆盘 LAMP INCAND 3MM WIRE TERM 2.5V
- 陶瓷 Vishay BC Components 径向,圆盘 CAP CER 150PF 1KV 10% RADIAL
- 嵌入式 - CPLD(复杂可编程逻辑器件) Altera 64-TFBGA IC MAX V CPLD 40 LE 64-MBGA
- 模块 - 插孔 TE Connectivity 64-TFBGA CONN MOD JACK R/A 8P8C SHIELDED
- 电路板衬垫,支座 Keystone Electronics 64-TFBGA STDOFF HEX M/F 6-32 1.250"L ALUM
- 矩形 - 外壳 TE Connectivity 64-TFBGA CONN HOUSING 8POS SINGLE CRIMP
- 面板至面板 - 面板衬垫,堆叠器 TE Connectivity 64-TFBGA CONN HEADR 36POS .100" DUAL ROW
- 陶瓷 Vishay BC Components 径向,圆盘 CAP CER 200PF 1KV 10% RADIAL
- 嵌入式 - CPLD(复杂可编程逻辑器件) Altera 100-TQFP IC MAX V CPLD 570 LE 100-TQFP