HI- 8683 ， HI- 8684封装尺寸
英寸（毫米）
18引脚塑料DIP
套餐类型： 18P
.905 ± .015
(22.99 ± .381)
.250 ± .010
(6.350 ± .254)
.300 ±.010
(7.62 ± .254)
.160 ± .025
(4.064 ± .635)
.135 ± .015
(3.429 ± .381)
7 °典型。
0° ~ 15°
.130 ± .020
(3.302 ± .508)
.100 ± .010
(2.540 ± .254)
.0115 ± .0035
(.2921 ± .0889)
.019 ± .004
(.483 ± .102)
.055 ±.010
(1.397 ± .254)
.335 ± .035
(8.509 ± .889)
18引脚塑料小外形封装（ SOIC ） - WB
（宽体）
.454 ± .008
(11.531 ± .203)
套餐类型： 18HW
.0105 ± .0015
(.2667 ± .0381)
.4065 ± .0125
(10.325 ± .318)
.293 ± .006
(7.442 ± .152)
SEE细节
.018
典型值
(.457)
.090 ± .010
(2.286 ± .254)
0° 8 °
.050
典型值
(1.27)
.033 ± .017
(.838 ± .432)
细节A
.0075 ± .0035
(.191 ± .089)
HOLT集成电路
9
