HI- 8683 ， HI- 8684封装尺寸
英寸（毫米）
18引脚塑料DIP
套餐类型： 18P
.905
±
.015
(22.99
±
.381)
.250
±
.010
(6.350
±
.254)
.300
±
.010
(7.62
±
.254)
.160
±
.025
(4.064
±
.635)
.135
±
.015
(3.429
±
.381)
7 °典型。
0° ~ 15
°
.130
±
.020
(3.302
±
.508)
.100
±
.010
(2.540
±
.254)
.0115 ± .0035
(.2921 ± .0889)
.019
±
.004
(.483
±
.102)
.055
±
.010
(1.397
±
.254)
.335 ± .035
(8.509
±
.889)
18引脚塑料小外形封装（ SOIC ） - WB
（宽体）
.454 ± .008
(11.531 ± .203)
套餐类型： 18HW
.0105 ± .0015
(.2667 ± .0381)
.4065 ± .0125
(10.325 ± .318)
.293 ± .006
(7.442 ± .152)
SEE细节
.018
典型值
(.457)
.090 ± .010
(2.286 ± .254)
0° 8 °
.050
典型值
(1.27)
.033 ± .017
(.838 ± .432)
细节A
.0075 ± .0035
(.191 ± .089)
HOLT集成电路
9
