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目录
5.2
按字母顺序排列的信号参考............................................... ........................... 63
热Specifications........................................................................................ 72
热Analysis................................................................................................. 72
6.2.1测量热规格........................................... 。 72
6.2.1.1处理器壳体温度的测量............................ 72
上电配置选项............................................. ........................... 75
时钟控制和低功耗国............................................ ...................... 75
7.2.1正常国家状态1 .......................................... ................................. 75
7.2.2 AutoHALT掉电状态，状态2 ......................................... ......... 75
7.2.3停止格兰特国家与国家3 ........................................ ............................. 76
7.2.4 HALT /格兰特史努比国家与国家4 ....................................... ................. 77
7.2.5睡眠状态，状态5 .......................................... .................................... 77
7.2.6深度休眠状态，国家6 ......................................... ........................... 78
温度监控................................................ .................................................. 78
7.3.1热敏二极管............................................. ........................................... 79
介绍......................................................................................................... 81
机械规格................................................ ................................... 81
8.2.1盒装处理器风扇散热器尺寸.......................................... 82
8.2.2盒装处理器风扇散热器重量.......................................... ........ 83
8.2.3盒装处理器保留机制和风扇散热器支持83 ....
盒装处理器要求............................................... .......................... 84
8.3.1风扇散热器电源........................................... ........................ 84
热Specifications........................................................................................ 85
8.4.1盒装处理器散热需求........................................... .... 85
8.4.2变速风扇............................................ ................................... 87
逻辑分析仪接口（ LAI） ............................................ ................................ 89
9.1.1机械注意事项............................................. ....................... 89
9.1.2电气考虑............................................. ........................... 89
6.0
散热规格及设计注意事项
................................. 71
6.1
6.2
7.0
特点
....................................................................................................................... 75
7.1
7.2
7.3
8.0
盒装处理器规格
................................................................................ 81
8.1
8.2
8.3
8.4
9.0
调试工具产品规格
........................................................................................ 89
9.1
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