PD75P3018
目录
1.引脚配置(顶视图) .......................................... .................................................. ......
2.框图...........................................................................................................................
3.引脚功能..............................................................................................................................
3.1
3.2
3.3
3.4
端口引脚....................................................................................................................................................
非端口引脚............................................................................................................................................
4
5
6
6
8
引脚输入/输出电路.......................................................................................................................... 10
推荐连接的未使用引脚............................................. ............................................ 12
MK I和MK II 4之间切换功能模式....................................... ................... 13
4.1
4.2
MK I模式和Mk II模式之间的区别......................................... ............................................. 13
设置堆栈银行选择寄存器( SBS ) ......................................... ........................................... 14
5.差异μPD75P3018和μPD753012 , 753016之间,并且753017 ....................... 15
6.内存配置........................................................................................................... 16
7.指令集.......................................................................................................................... 20
8.一次性可编程(程序存储器)写入和检验..................................... .............. 30
8.1
8.2
8.3
8.4
操作模式为程序存储器写入/校验.......................................... ................................... 30
程序存储器写程序.......................................................................................................... 31
程序存储器中读取程序.......................................................................................................... 32
一次性可编程筛选...................................................................................................................... 33
9.电气特性.............................................. .................................................. 34
10.封装图纸................................................................................................................... 48
11.推荐焊接条件............................................. ................................... 50
附录A μPD75316B , 753017和75P3018功能列表......................................... .......... 51
附录B开发工具.............................................. .................................................. 53
附录C相关文件.............................................. .................................................. 57
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