Qualpack TSC87251G2D
1.一般Information........................................................................................................................... 3
1.1产品Description............................................................................................................................ 3
2.技术Information..................................................................................................................... 4
2.1晶圆制程技术................................................................................................................. 4
2.1.1 SCMOS3 0.5um的ROM过程.......................................... .................................................. 4 .......
2.1.2 SCMOS3 NV 0.5um的EPROM程序......................................... ................................................ 6
2.2产品设计.................................................................................................................................. 6
2.3封装技术.......................................................................................................................... 6
2.3.1包装说明................................................................................................................... 6
2.3.2其他可用的软件包............................................................................................................ 7
2.4测试.................................................................................................................................................. 7
2.5设备截面......................................................................................................................... 8
2.6晶圆工艺Control........................................................................................................................ 9
3.资格.................................................................................................................................... 10
3.1更换步骤........................................................................................................................... 11
3.2资格Flow............................................................................................................................. 12
3.3晶圆工艺Qualification.............................................................................................................. 13
3.3.1处理模块的可靠性........................................................................................................ 13
3.3.1.1热载流子qualification.............................................................................................................................................. 13
3.3.1.2 Electromigration.......................................................................................................................................................... 15
3.3.1.3时间相关介质击穿.................................................................................................................. 16
3.3.2 Z92晶片工艺评定结果.......................................... ......................................... 18
3.3.3 Z94晶片工艺评定结果.......................................... ......................................... 19
3.4包装Qualification....................................................................................................................... 20
3.5设备Qualification.......................................................................................................................... 20
3.5.1失效机理和纠正措施.......................................... ..................................... 21
3.5.2认证状态................................................................................................................... 21
3.6出厂质量和可靠性........................................................................................................ 22
3.6.1 AOQ （平均出厂Quality)............................................................................................... 22
3.6.2 EFR （早期故障率） ........................................................................................................... 22
3.6.3 LFR （潜在失效Rate).......................................................................................................... 23
4.用户信息.............................................................................................................................. 24
4.1焊接建议............................................................................................................ 24
4.2干燥包排序规则................................................................................................................ 24
4.3 ESD caution..................................................................................................................................... 24
5.环境信息.............................................................................................................. 25
6.其他Data........................................................................................................................................ 26
6.1通过ISO9001认证Certificate............................................................................................................ 26
6.2数据手册参考........................................................................................................................ 27
6.3地址Reference........................................................................................................................... 27
7.修订History............................................................................................................................... 28
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转速0 - 1999年10月
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