SX1210
先进的通信&传感
目录
1.简介.............................................. ..................... 5
1.1 。简化框图............................................... ......... 5
1.2 。引脚图................................................ ............................ 6
1.3 。引脚说明................................................ ........................ 7
2，电气特性.............................................. .............. 8
2.1 。 ESD注意事项................................................ .............................. 8
2.2 。绝对最大额定值............................................... 8 .....
2.3 。经营范围................................................ ..................... 8
2.4 。芯片规格................................................ ................... 8
2.4.1 。功耗................................................ ............. 8
2.4.2 。频率合成................................................ ........... 9
2.4.3 。接收器................................................. ............................ 10
2.4.4 。数字................................................规格............ 11
3.结构说明.............................................. ............. 12
3.1 。电源策略............................................... ........... 12
3.2 。频率合成说明......................................... 13
3.2.1 。参考振荡器................................................ .......... 13
3.2.2 。 CLKOUT输出................................................ ................. 13
3.2.3 。锁相环结构................................................ ................ 14
3.2.4 。 PLL权衡................................................ ..................... 14
3.2.5 。压控振荡器............................................. 15
3.2.6 。 PLL环路滤波器............................................... .................... 15
3.2.7 。 PLL锁定检测指标............................................. 16
3.2.8 。频率计算................................................ ....... 16
3.3 。接收机说明................................................ ............. 17
3.3.1 。建筑................................................. ....................... 17
3.3.2 。 LNA和混频器首先.............................................. ............. 18
3.3.3 。 IF增益和第二I / Q混频器.......................................... 18
3.3.4 。信道滤波器................................................ ................... 18
3.3.5 。信道滤波器在FSK模式................................. 19设置
3.3.6 。在OOK模式信道滤波器设置................................ 20
3.3.7 。 RSSI ................................................. .................................. 20
3.3.8 。 FDEV在设置接收模式........................................... 22
3.3.9 。 FSK解调器................................................ .............. 22
3.3.10 。 OOK解调器................................................ ........... 22
3.3.11 。位同步................................................ ............... 25
3.3.12 。另设置................................................ .......... 26
3.3.13 。数据输出................................................ ...................... 26
4.操作模式.............................................. ........................ 27
4.1 。操作模式............................................... ............... 27
4.2 。数字引脚配置与芯片模式............................... 27
5.数据处理.............................................. ......................... 28
5.1 。概述................................................. .............................. 28
5.1.1 。框图................................................ .................... 28
5.1.2 。数据操作模式............................................... ........ 28
5.2 。控制块说明............................................... ....... 29
5.2.1 。 SPI接口................................................ ...................... 29
5.2.2 。 FIFO ................................................. .................................. 31
5.2.3 。同步字识别............................................... ...... 33
5.2.4 。包处理器................................................ ................... 34
5.2.5 。控制................................................. ............................... 34
5.3 。连续模式................................................ .................. 35
5.3.1 。概述................................................ ........... 35
5.3.2 。接收处理................................................ .................... 36
5.3.3 。中断信号映射............................................... ... 36
5.3.4 。的uC连接................................................ .................. 37
5.3.5 。连拍模式示例............................................... ..37
5.4 。缓冲模式................................................ ....................... 38
5.4.1 。概述................................................ ............ 38
5.4.2 。接收处理................................................ ..................... 38
5.4.3 。中断信号映射............................................... .... 39
5.4.4 。的uC连接................................................ .................. 40
5.4.5 。缓冲模式示例............................................... ...... 40
5.5 。包模式................................................ .......................... 41
5.5.1 。概述................................................ ............ 41
5.5.2 。包格式................................................ ..................... 41
5.5.3 。接收处理................................................ ..................... 43
5.5.4 。包过滤................................................ ................... 43
5.5.5 。 DC -Free数据.............................................机制... 45
5.5.6 。中断信号映射............................................... ...... 46
5.5.7 。的uC连接................................................ .................. 46
5.5.8 。分组模式示例............................................... ......... 48
5.5.9 。附加信息................................................ ......... 48
6.配置和状态寄存器.......................................... 49
6.1 。概述................................................ ............... 49
6.2 。主要配置寄存器 - MCParam ............................... 49
6.3 。中断配置参数 - IRQParam ................... 51
6.4 。接收器的配置参数 - RXParam .................... 53
6.5 。同步字参数 - SYNCParam .................................. 54
6.6 。振荡器参数 - OSCParam ....................................... 55
6.7 。数据包处理参数 - PKTParam ............................ 56
7.应用信息.............................................. ............... 57
7.1 。晶体谐振器规格............................................. 57
7.2 。软件的频率计算....................................... 57
7.2.1 。 GUI ................................................. ..................................... 57
7.2.2 。为.dll的自动化生产台式.................................... 57
7.3 。开关时间和过程.......................................... 57
7.3.1 。优化的接收周期............................................... ..... 58
7.3.2 。接收器跳频优化循环......................... 59
7.4 。芯片复位.............................................. ..................... 60
7.4.1 。 POR ................................................. ................................... 60
7.4.2 。手动复位................................................ ...................... 60
7.5 。参考设计................................................ .................. 61
7.5.1 。应用原理图................................................ ......... 61
7.5.2 。 PCB布局................................................ ......................... 61
7.5.3 。条例草案的材料............................................... ...................... 62
7.5.4 。对于工具............................................ 63订购信息
7.6 。参考设计性能............................................. 63
7.6.1 。灵敏度平整度................................................ ............. 65
7.6.2 。灵敏度与LO漂移............................................. ............ 66
7.6.3 。灵敏度与接收机带宽............................................. ... 67
7.6.4 。灵敏度的温度稳定性和电压............ 68
7.6.5 。灵敏度与比特率............................................. ........... 68
7.6.6 。邻道抑制............................................... 0.69
8.包装信息.............................................. ................ 71
8.1 。封装外形图............................................... ....... 71
8.2 。 PCB焊盘布局............................................... ................... 71
8.3 。磁带&卷轴规格.............................................. ........ 72
9.修订历史.............................................. .......................... 73
10.联系方式.............................................. ................... 73
转2 - 2008年9月8日
th
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