【SM320VC5507-EP定点数字信号处理器数据手册PRODUCTION数据信息为出版日期。产品符】,IC型号SM320VC5507PGESEP,SM320VC5507PGESEP PDF资料,SM320VC5507PGESEP经销商,ic,电子元器件-51电子网

SM320VC5507-EP

定点数字信号处理器

数据手册

PRODUCTION数据信息为出版日期。

产品符合占德州条款规范

仪器标准保修。生产加工过程中不

不一定包括所有参数进行测试。

文献编号： SPRS613

2009年9月

SM320VC5507-EP

SPRS613 - 2009年9月

www.ti.com

特点

.............................................................................................................................

.........................................

介绍

......................................................................................................................

2.1

描述

.................................................................................................................

2.2

引脚分配

...........................................................................................................

2.3

信号说明

........................................................................................................

功能概述

..........................................................................................................

3.1

功能框图

................................................................................................

3.2

内存

.....................................................................................................................

3.2.1

片上双存取RAM （ DARAM ）

.......................................................................

3.2.2

片上单存取RAM （ SARAM ）

.....................................................................

3.2.3

片上的只读存储器（ROM）的

.........................................................................

3.2.4

存储器映射

...................................................................................................

3.2.4.1

PGE封装存储器映射

......................................................................

3.2.5

引导配置

..............................................................................................

3.3

外设

.................................................................................................................

3.4

直接存储器访问（DMA ）控制器

...............................................................................

3.4.1

DMA通道控制寄存器（ DMA_CCR ）

...............................................................

3.5

C接口

................................................................................................................

3.6

可配置的对外巴士

.............................................................................................

3.6.1

外部总线选择寄存器（ EBSR ）

....................................................................

3.6.2

并口

.....................................................................................................

3.6.3

并行端口信号路由

...................................................................................

3.7

通用输入/输出（ GPIO ）端口

..........................................................................

3.7.1

专用的通用I / O

..............................................................................

3.7.2

地址总线的通用I / O

...........................................................................

3.7.3

EHPI通用I / O

....................................................................................

3.8

系统寄存器

...........................................................................................................

3.9

USB时钟生成

....................................................................................................

3.10存储器映射寄存器

..............................................................................................

3.11外设寄存器说明

..........................................................................................

3.12中断

....................................................................................................................

3.12.1 IFR和IER寄存器

.........................................................................................

3.12.2中断时序

.................................................................................................

3.12.3醒来从空闲状态

.............................................................................

3.12.3.1醒来从闲置，振荡器已禁用

...............................................

3.12.4空转时钟域时，外部并行总线工作在EHPI模式

............................

支持

............................................................................................................................

4.1

通知关于JTAG （ IEEE 1149.1 ）边界扫描测试能力

........................................

4.1.1

对于边界扫描测试的初始化要求

.......................................................

4.1.2

边界扫描描述语言（ BSDL ）模式

.....................................................

4.2

文档支持

...................................................................................................

4.3

TMS320VC5507器械命名

................................................................................

电气规格

.....................................................................................................

5.1

绝对最大额定值

......................................................................................

5.2

推荐工作条件

.......................................................................

1.1

支持国防，航天和医疗应用

SM320VC5507-EP

www.ti.com

SPRS613 - 2009年9月

5.3

.....................................

5.2.2

推荐工作条件的简历

= 1.35 V（ 144兆赫）

....................................

5.2.3

推荐工作条件的简历

= 1.6 V（ 200兆赫）

.....................................

电气特性

....................................................................................

5.2.1

推荐工作条件的简历

= 1.2 V（ 108兆赫）

5.3.1

5.3.2

5.3.3

电气特性在推荐的工作温度范围为CV

1.2 V（ 108 MHz）的（除非另有说明）

................................................................

电气特性在推荐的工作温度范围为CV

1.35 V（ 144 MHz）的（除非另有说明）

...............................................................

电气特性在推荐的工作温度范围为CV

1.6 V（ 200 MHz）的（除非另有说明）

................................................................

.........................................................................................................

5.5

时序参数符号

...........................................................................................

5.6

时钟选项

..............................................................................................................

5.6.1

内部系统振荡器和外部晶体

...........................................................

5.6.2

布局的注意事项

.........................................................................................

5.6.3

时钟发生器在旁路模式（ DPLL禁用）

......................................................

5.6.4

时钟发生器在锁定模式（ DPLL合成已启用）

..............................................

5.6.5

实时时钟振荡器的晶体

..........................................................

5.7

存储器接口时序

................................................................................................

5.7.1

异步内存时序

..............................................................................

5.7.2

同步DRAM （ SDRAM ）时序

.....................................................................

5.8

复位时序

..............................................................................................................

5.8.1

上电复位（片上振荡器活动）

...............................................................

5.8.2

上电复位（片上振荡器无效）

.............................................................

5.8.3

热复位

.....................................................................................................

5.9

外部中断时序

................................................................................................

5.10唤醒从IDLE

......................................................................................................

5.11 XF计时

.................................................................................................................

5.12通用输入/输出（ GPIOx ）时序

......................................................................

5.13 TIN / TOUT计时（定时器0只）

.......................................................................................

5.14多通道缓冲串行端口（ McBSP的）时序

.................................................................

5.14.1 McBSP0的时序

...............................................................................................

5.14.2和McBSP1的McBSP2的时序

...............................................................................

5.14.3的McBSP作为SPI主模式或从时序

....................................................................

5.14.4 McBSP的通用I / O时序

.......................................................................

5.15增强型主机端口接口（ EHPI ）时序

........................................................................

5.16 I

计时

................................................................................................................

101

5.17通用串行总线（ USB）的时序

...................................................................................

103

5.18 ADC时序

..............................................................................................................

104

机械数据

..............................................................................................................

105

6.1

封装热阻特性

.......................................................................

105

6.2

包装信息

...................................................................................................

105

5.4

ESD性能

SM320VC5507-EP

SPRS613 - 2009年9月

www.ti.com

图列表

2-1

3-1

3-2

3-3

3-4

3-5

3-6

3-7

3-8

3-9

3-10

3-11

3-12

3-13

3-14

3-15

3-16

3-17

3-18

3-19

3-20

4-1

5-1

5-2

5-3

5-4

5-5

5-6

5-7

5-8

5-9

5-10

5-11

5-12

5-13

5-14

5-15

5-16

5-17

5-18

5-19

5-20

5-21

5-22

5-23

5-24

.......................................................................

在SM320VC5507的框图

.........................................................................................

SM320VC5507存储器映射

...................................................................................................

DMA_CCR位的位置

........................................................................................................

外部总线选择寄存器

................................................................................................

并行端口信号路由

.....................................................................................................

并行端口（ EMIF ）信号接口

..........................................................................................

I / O方向寄存器（ IODIR ）位布局

.....................................................................................

I / O数据寄存器（ IODATA ）位布局

.......................................................................................

地址/ GPIO使能寄存器（ AGPIOEN ）位布局

.....................................................................

地址/ GPIO方向寄存器（ AGPIODIR ）位布局

.................................................................

地址/ GPIO数据寄存器（ AGPIODATA ）位布局

....................................................................

EHPI GPIO使能寄存器（ EHPIGPIOEN ）位布局

....................................................................

EHPI GPIO方向寄存器（ EHPIGPIODIR ）位布局

................................................................

EHPI GPIO数据寄存器（ EHPIGPIODATA ）位布局

...................................................................

系统寄存器位的位置

..................................................................................................

USB时钟生成

...........................................................................................................

USB PLL选择和状态寄存器位布局

.........................................................................

USB APLL时钟模式寄存器位布局

..................................................................................

IFR0和IER0位的位置

....................................................................................................

IFR1和IER1位的位置

....................................................................................................

设备命名为TMS320VC5507

...............................................................................

3.3 -V测试负载电路

..........................................................................................................

内部系统振荡器和外部晶体

.............................................................................

旁路模式时钟计时

....................................................................................................

外部乘用-N时钟时序

..........................................................................................

实时时钟振荡器的晶体

............................................................................

异步存储器读时序

.........................................................................................

异步存储器写时序

.........................................................................................

三SDRAM读命令

..............................................................................................

三SDRAM WRT命令

...............................................................................................

SDRAM ACTV命令

.......................................................................................................

SDRAM DCAB命令

......................................................................................................

SDRAM REFR命令

.......................................................................................................

SDRAM MRS命令

........................................................................................................

SDRAM的自刷新命令

...............................................................................................

上电复位（片上振荡器活动）时序

.......................................................................

上电复位（片上振荡器无效）时序

.....................................................................

复位时序

....................................................................................................................

外部中断时序

.......................................................................................................

唤醒从IDLE计时

..................................................................................................

XF计时

........................................................................................................................

通用输入/输出（ IOx扩展）信号配时

........................................................................

TIN / TOUT计时当配置为输入

.............................................................................

TIN / TOUT计时当配置为输出

...........................................................................

McBSP的接收时序

........................................................................................................

144引脚PGE小外形四方扁平封装（顶视图）

图列表

SM320VC5507-EP

www.ti.com

SPRS613 - 2009年9月

5-25

5-26

5-27

5-28

5-29

5-30

5-31

5-32

5-33

5-34

5-35

5-36

5-37

5-38

5-39

5-40

McBSP的发送时序

.......................................................................................................

McBSP的时序为SPI Master或Slave ： CLKSTP = 10B ， CLKXP = 0

...................................................

McBSP的时序为SPI Master或Slave ： CLKSTP = 11B ， CLKXP = 0

...................................................

McBSP的时序为SPI Master或Slave ： CLKSTP = 10B ， CLKXP = 1

...................................................

McBSP的时序为SPI Master或Slave ： CLKSTP = 11B ， CLKXP = 1

...................................................

McBSP的通用I / O时序

.........................................................................................

提示计时

.....................................................................................................................

EHPI非复用的读/写时序

....................................................................................

EHPI复用的存储器（ HPID ）读/写时序没有自动增量

.........................................

EHPI复用的存储器（ HPID ）读时序有了自动增量

....................................................

EHPI复用的存储器（ HPID ）收件正时自动增量

..................................................

100

EHPI复用寄存器读/写时序

............................................................................

100

C接收时序

............................................................................................................

102

C发射时序

...........................................................................................................

103

....................................................................................................................

全速负载

...............................................................................................................

USB计时

104

图列表