目录
1.0
介绍
.................................................................................................................. 7
1.1
1.2
Terminology........................................................................................................... 8
1.1.1处理器包装术语............................................ ............... 8
参考文献..........................................................................................................10
系统总线和GTLREF .............................................. ..................................... 11
电源和地引脚.............................................. ........................................ 11
解耦准则................................................ ........................................ 11
2.3.1 VCC去耦............................................. ........................................ 12
2.3.2系统总线AGTL +解耦........................................... .................. 12
电压识别................................................ ........................................... 12
2.4.1锁相环（ PLL ），电源和滤波器...................................... ......... 14
保留，未使用引脚和TESTHI [ 12 ： 0 ] ...................................... .................. 16
系统总线信号组.............................................. ................................... 17
异步GTL +信号............................................... ................................ 18
测试访问端口（ TAP ）连接........................................... ......................... 19
系统总线频率选择信号（ BSEL [ 1 ： 0 ] ） ..................................... ....... 19
最大Ratings................................................................................................19
处理器直流规范............................................... ................................ 20
AGTL +系统总线规格.............................................. ....................... 26
包装中的产品规格............................................... ............................... 32
处理器插入规格............................................... ....................... 33
处理器群众规格............................................... ............................ 33
处理器Materials.............................................................................................33
处理器Markings.............................................................................................34
处理器的引脚分配............................................... ................................. 37
按字母顺序排列的信号参考............................................... ........................... 53
热指标................................................ ........................................ 63
5.1.1测量热规格........................................... 0.64
5.1.1.1处理器壳体温度的测量............................ 64
上电配置选项............................................. ........................... 65
时钟控制和低功耗国............................................ ...................... 65
6.2.1正常国家状态1 .......................................... ................................. 65
6.2.2 AutoHALT掉电状态，状态2 ......................................... .......... 65
6.2.3停止格兰特国家与国家3 ........................................ ............................. 66
6.2.4 HALT /格兰特史努比国家与国家4 ....................................... ................. 67
6.2.5睡眠状态，状态5 .......................................... .................................... 67
6.2.6深度休眠状态，国家6 ......................................... ........................... 68
2.0
电气规格
........................................................................................11
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
2.10
2.11
2.12
3.0
包装机械产品规格
.................................................................29
3.1
3.2
3.3
3.4
3.5
4.0
销上市及信号定义
.....................................................................37
4.1
4.2
5.0
散热规格及设计注意事项
.................................61
5.1
6.0
特点
.......................................................................................................................65
6.1
6.2
数据表
3
QQ：2881677436 复制
