LM10506
目录
1.0概述......................................................................................................................... 1
2.0主要规格........................................................................................................................... 1
3.0产品特点........................................................................................................................................ 1
4.0应用.................................................................................................................................... 1
5.0典型应用图.............................................................................................................. 1
6.0概述........................................................................................................................................ 3
6.1电源规格........................................................................................................ 3
7.0连接图以及包装标志............................................ ............................................. 4
8.0 LM10506引脚说明................................................................................................................五
9.0订购信息........................................................................................................................五
10.0绝对最大额定值............................................................................................................. 6
11.0工作额定值.......................................................................................................................... 6
12.0通用电气特性.............................................. .................................................. 6 ....
13.0巴克1电气特性..................................................................................................... 7
14.0巴克2电气特性..................................................................................................... 8
15.0巴克3电气特性..................................................................................................... 8
16.0 LDO电气特性........................................................................................................ 9
17.0比较器电气特性.............................................. ............................................... 9
18.0典型性能特征.............................................. ................................................ 11
19.0概述..................................................................................................................... 15
19.1 SPI数据接口......................................................................................................... 16
19.1.1配置寄存器通过SPI接口......................................... ........................ 17
19.1.1.1 ADDR 0x07& 0x08的：降压1和2降压电压编码和V
OUT
级映射........ 19
19.1.1.2 ADDR为0x00 & ×09 ： 3降压电压编码和V
OUT
级映射........................ 20
19.1.1.3 ADDR 0x0B中：比较器的阈值映射......................................... .............. 21
19.2降压转换器运行.............................................. ......................................... 22
19.2.1降压稳压器说明............................................ ............................................ 22
19.2.2 PWM操作.......................................................................................................... 22
19.2.3 PFM操作（雄鹿1,2 & 3 ） ..................................... .............................................. 23
19.2.4软启动................................................................................................................... 23
19.2.5限流.......................................................................................................... 23
19.2.6内部同步整流............................................ .................................... 24
19.2.7旁路- FET操作上的降压1和巴克2 ..................................... ........................... 24
19.2.8低压差操作............................................ .................................................. 24
20.0设备的工作模式.............................................................................................................. 25
20.1启动顺序......................................................................................................... 25
20.2上电默认和设备启用.......................................... ............................. 25
20.3复位：引脚功能....................................................................................................... 25
20.4待机：功能......................................................................................................... 25
20.4.1待机引脚............................................................................................................ 25
通过SPI 20.4.2待机编程........................................... ....................................... 26
20.5 HL_B2 ， HL_B3功能............................................. .................................................. ..... 26
20.6欠压锁定（ UVLO ） ............................................ ........................................ 26
20.7过压锁定（ OVLO ） ............................................ .......................................... 26
20.8设备状态，中断允许............................................ .................................... 26
20.9热关断（ TSD ） ............................................ .................................................. 26
20.10比较器.................................................................................................................. 27
21.0外部元件的选择..................................................................................................... 28
21.1输出电感&电容选择............................................ .................. 28
21.2电感的选择...................................................................................................... 28
21.2.1推荐方法电感的选择： ......................................... ....................... 28
21.2.2替代方法电感的选择： ......................................... ............................... 28
21.2.2.1建议的电感器和它们的供应商.......................................... ................... 28
21.2.3输出和输入电容器特性.......................................... ... 29
21.2.3.1输出电容的选择............................................ ..................................... 29
21.2.3.2输入电容的选择............................................ ....................................... 30
22.0 PCB布局考虑.......................................................................................................... 31
22.1 PCB LAYOUT热耗散的micro SMD封装...................................... 32
23.0物理尺寸.................................................................................................................... 33
www.ti.com
2
QQ：2881677436 复制
