SHARP
LHFl6504
1
目录
页面
简介..
............................................................ 3
5设计考虑
页面
....................................... 25
1.1特性................................................ ........................ 3
1.2产品概述............................................. .. .......... 3
1.3产品说明............................................. .. ...... 0.4
1.3.1封装引脚............................................. ......... 0.4
1.3.2组织块.. ........................................... 4 ....
操作原理.. ...................................... 7
2.1数据保护............................................. .. ............. 0.8
总线操作................................................ ............ 8
3.1阅读................................................ .............................. 8
3.2输出禁止............................................... ............... 8
3.3备用.. .............................................. ......................... 8
3.4复位................................................ ............................. 8
3.5读取识别码.. ............................................ .... 0.9
3.6写.. .............................................. ............................ 0.9
命令
释义
............................................. 9
5.1三线输出控制........................................ 25
5.2 RY / BY #和WSM投票....................................... 25
5.3电源去耦......................................... 25
5.4 Vccw跟踪印刷电路板..................... 25
5.5 V ,, 。 vccw 。
RP #转换.................................... 25
保护.. ..................................... 26
5.6上电/下
5.7功耗............................................... ....... 26
5.8数据保护法............................................. 26
6电气
特定网络阳离子
................................ 27
6.1绝对最大额定值.. .................................... 27
6.2工作条件............................................... .. 27
6.2.1电容.............................................. ............ 27
6.2.2 AC输入/输出测试条件.. ...................... 28
6.2.3直流特性............................................. .. 29
6.2.4交流特性 - 只读操作........ 31
6.2.5交流特性 - 写操作................ 34
6.2.6替代CE# -Controlled写...................... 36
6.2.7复位操作............................................. ..... 38
6.2.8块擦除。整片擦除,字/字节写和
锁定位配置性能................. 39
7包
和包装规格
.......... 40
4.1读阵列命令.. ............................................ .. 12
4.2读取识别码命令............................... 12
4.3读状态寄存器命令.. ............................... 12
4.4清除状态寄存器命令.. ............................... 12
4.5块擦除命令.. ............................................ 13
4.6整片擦除命令......................................... 13
4.7字/字节写命令.. ..................................... 13
4.8块擦除挂起命令................................ I4
4.9字/字节写入暂停命令.. ...................... 14
4.10设置Block和永久船闸位命令.. ....... I5
4.1 1块清除锁定位命令............................ 15
4.12块锁定在WP # ...................................... 16
修订版1.25