DS21FT44/DS21FF44
目录
1.多芯片模块（ MCM ）说明........................................ ................................. 1
2. MCM LEAD描述............................................................................................................7
3. DS21FF44 （四个X四）印刷电路板的焊盘图形....................................... ................................ 15
4. DS21FT44 （四×3 ） PCB焊盘布局....................................... ......................................... 16
5. DS21Q42 DIE描述........................................................................................................17
6. DS21Q44简介............................................................................................................18
7. DS21Q44引脚功能描述............................................ ...................................... 21
8. DS21Q44寄存器映射.............................................................................................................27
9.并行端口...........................................................................................................................32
10.控制，标识和测试寄存器.......................................... ............................................ 32
11.状态和信息寄存器............................................ ................................. 41
12.错误计数REGISTERS........................................................................................................47
13. DS0监控功能...................................................................................................49
14.信令操作.............................................................................................................52
14.1处理器的信令............................................................................................................52
14.2基于硬件的信令..............................................................................................................55
15.每通道代码生成和环回......................................... ............ 56
15.1发送端代码GENERATION.....................................................................................................56
15.1.1
15.1.2
简单的空闲码插入和每通道环回......................................... ........................... 56
每个信道编码Insertion...............................................................................................................57
15.2接收端代码生成.......................................................................................................58
16.计数停止REGISTERS................................................................................................59
17.弹性存储器OPERATION..................................................................................................60
17.1接收SIDE............................................................................................................................................61
17.2发送端.........................................................................................................................................61
18.附加（SA ）和国际（SI ）位操作..................................... 0.61
18.1硬件设计方案...............................................................................................................................61
基于双帧18.2内部寄存器方案......................................... .................... 62
基于CRC4多帧18.3内部寄存器方案.......................................... .............. 63
19. HDLC控制器的SA位或DS0 ........................................ .......................... 65
19.1总体概述...............................................................................................................................65
19.2 HDLC状态寄存器......................................................................................................................66
19.3基本操作DETAILS....................................................................................................................67
19.4 HDLC寄存器描述..............................................................................................................68
4 110
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