CS5532/34-BS
目录
1.特性和规范............................................. ............. 4
模拟特征................................................ .......................... 4
典型均方根噪声（ NV ） ............................................ ................................... 7
典型的无噪声分辨率（ BITS ） .......................................... ......... 7
5 V数字特征.............................................. ...................... 8
3 V数字特征.............................................. ...................... 8
动态特性................................................ ........................ 9
绝对最大额定值............................................... ...................... 9
开关特性................................................ .................. 10
2.概述.............................................. ......................................... 12
2.1 。模拟量输入....................................................................................................12
2.1.1 。模拟输入范围............................................... ..................................... 13
2.1.2 。复沉降限制............................................... ............. 13
2.1.3 。电压噪声密度性能.............................................. ....... 13
2.1.4 。无偏移DAC ............................................... ....................................... 14
2.2 。 ADC寄存器结构的概述和操作模式............................ 14
2.2.1 。系统初始化................................................ .............................. 15
2.2.2 。串行端口接口............................................... ............................... 22
2.2.3 。读取/写入片内寄存器........................................... ........... 23
2.3 。配置寄存器................................................ ..................................... 23
2.3.1 。功耗................................................ ............................. 23
2.3.2 。系统复位序列............................................... ....................... 23
2.3.3 。输入短................................................ ............................................ 24
2.3.4 。保护信号................................................ ......................................... 24
2.3.5 。电压参考选择............................................... ...................... 24
2.3.6 。输出锁存器的引脚............................................... .................................. 24
2.3.7 。偏移和增益选择.............................................. ............................ 25
2.3.8 。过滤速率选择............................................... ................................... 25
2.4 。为测量设置的客户服务代表........................................... .............. 27
2.5 。校准........................................................................................................30
2.5.1 。校准寄存器................................................ ............................ 30
2.5.2 。执行校准................................................ ........................ 31
2.5.3 。自校正................................................ ..................................... 31
2.5.4 。系统校准................................................ ................................ 32
2.5.5 。校准提示................................................ ..................................... 32
2.5.6 。在校准范围限制.............................................. ............. 33
2.6 。执行转换................................................ .................................. 33
2.6.1 。单次转换模式............................................... ........................ 33
2.6.2 。连续转换模式............................................... ............... 34
2.6.3 。采用CSR的执行转换和校准的例子.... 35
2.7 。使用多个ADC的同步方式.............................................. ................. 36
2.8 。转换输出编码............................................... ............................... 36
2.9 。数字滤波器......................................................................................................38
2.10 。时钟发生器................................................ ............................................... 39
2.11 。电源安排............................................... ............................ 39
2.12 。入门................................................ ................................................ 43
2.13 。 PCB布局.....................................................................................................43
3.引脚说明.............................................. ................................................. 44
4.规范说明.............................................. ................................. 46
5.订购信息.............................................. ....................................... 47
6.环境，制造， &处理情况.............. 47
7.封装图纸.............................................. ............................................. 48
2
DS755F3
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