COP8AME9
目录
1.0概述..................................................................................................................................... 1
2.0产品特点....................................................................................................................................................... 1
3.0框图.............................................................................................................................................. 2
4.0订购信息.................................................................................................................................... 2
5.0连接图.................................................................................................................................... 6
6.0结构概述................................................................................................................................. 8
6.1降低EMI ...................................................................................................................................... 8
6.2在系统编程和虚拟EEPROM .......................................... .............................. 8
6.3双时钟和时钟倍频............................................ .................................................. 8 .....
6.4 TRUE在系统仿真.............................................................................................................. 8
6.5建筑..................................................................................................................................... 8
6.6指令集................................................................................................................................. 8
6.6.1主要指令集特点............................................................................................................... 8
6.6.2单字节/执行单周期代码........................................ ................................................. 8
6.6.3许多单字节，多功能说明...................................... .............................................. 8
6.6.4位电平控制.................................................................................................................................. 9
6.6.5寄存器集......................................................................................................................................... 9
6.7包装/ PIN效率................................................................................................................ 9
7.0绝对最大额定值....................................................................................................................... 10
8.0电气特性............................................................................................................................ 10
9.0引脚说明......................................................................................................................................... 15
9.1仿真连接................................................................................................................... 16
10.0功能描述.............................................................................................................................. 16
10.1 CPU寄存器................................................................................................................................. 16
10.2程序存储器........................................................................................................................... 17
10.3数据存储器.................................................................................................................................... 17
10.4数据存储器段夯扩............................................ ...................................... 17
10.4.1虚拟EEPROM .............................................................................................................................. 18
10.5选项寄存器............................................................................................................................. 18
10.6安全............................................................................................................................................ 19
10.7 RESET ................................................................................................................................................... 19
10.7.1外部复位................................................................................................................................. 20
10.7.2片欠压复位................................................................................................................. 20
10.8振荡电路...................................................................................................................... 21
10.8.1振荡器.......................................................................................................................................... 21
10.8.2时钟倍频.................................................................................................................................. 22
10.9控制寄存器....................................................................................................................... 22
10.9.1 CNTRL寄存器（地址X'00EE ） ....................................... .................................................. ........ 22
10.9.2 PSW寄存器（地址X'00EF ） ..................................................................................................... 22
10.9.3 ICNTRL寄存器（地址X'00E8 ） ....................................... .................................................. ....... 23
10.9.4 T2CNTRL寄存器（地址X'00C6 ） ....................................... .................................................. .... 23
10.9.5 T3CNTRL寄存器（地址X'00B6 ） ....................................... .................................................. .... 23
10.9.6 HSTCR寄存器（地址X'00AF ） ....................................... .................................................. ....... 23
10.9.7 ITMR寄存器（地址X'00CF ） ....................................... .................................................. ........... 23
10.9.8 ENAD寄存器（地址X'00CB ） ....................................... .................................................. ......... 23
11.0在系统编程........................................................................................................................... 24
11.1简介................................................................................................................................... 24
11.2功能描述.............................................................................................................. 24
11.3寄存器.......................................................................................................................................... 24
11.3.1 ISP地址寄存器..................................................................................................................... 24
11.3.2 ISP读取数据寄存器.................................................................................................................. 24
11.3.3 ISP写入数据寄存器................................................................................................................... 24
11.3.4 ISP写时序注册................................................................................................................ 25
11.4操纵之间来回FLASH存储器和Boot ROM ..................... 25
11.5强制执行为从引导ROM ............................................ ............................................. 26
11.6返回到Flash存储器，而无需硬件复位.......................................... ............. 26
11.7 MICROWIRE / PLUS ISP ........................................................................................................................ 26
11.8用户的ISP和虚拟电子书
2
................................................................................................................ 27
11.9限制软件的时候调用BOOT ROM ISP例程....................... 29
11.10闪存耐久性注意事项............................................. ........................... 29
12.0定时器.......................................................................................................................................................三十
12.1定时器T0 （空闲时间） ......................................................................................................................三十
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