目录
目录
1
Introduction.................................................................................................................................... 11
1.1
1.2
2
2.1
2.2
2.3
术语........................................................................................................................ 12
1.1.1处理器包装术语............................................ ............................ 12
参考文献......................................................................................................................... 13
FSB和GTLREF............................................................................................................... 15
电源和接地Lands................................................................................................... 15
脱钩Guidelines........................................................................................................ 15
2.3.1 VCC去耦............................................. .................................................. ..... 16
2.3.2 FSB GTL + Decoupling........................................................................................... 16
2.3.3外频时钟( BCLK [1 :0])和处理器时钟.................................. ................. 16
电压识别.......................................................................................................... 17
2.4.1锁相环( PLL ),电源和滤波器...................................... ........................ 19
保留,未使用的, FC和TESTHI信号.......................................... ............................ 20
FSB信号灯组............................................................................................................. 21
GTL +异步信号............................................... ............................................... 22
测试访问端口( TAP )连接........................................... ........................................ 23
FSB频率选择信号( BSEL [ 2 : 0 ] ) ..................................... ................................. 23
绝对最高和最低等级............................................. ............................ 24
处理器直流规范............................................... ............................................... 24
VCC过冲规范............................................... .............................................. 33
2.12.1模电压验证............................................ ............................................... 33
GTL + FSB Specifications....................................................................................................34
包装机械制图............................................... ............................................. 35
处理器组件禁入区............................................ ................................. 39
装载包Specifications......................................................................................... 39
包处理Guidelines............................................................................................. 39
包插入Specifications........................................................................................ 40
处理器大众Specification............................................................................................. 40
处理材料............................................................................................................ 40
处理器标志............................................................................................................ 40
处理器土地坐标............................................... ............................................... 41
处理器土地分配............................................... .............................................. 43
按字母顺序排列的信号参考............................................... ........................................... 66
处理器散热规格............................................... ....................................... 75
5.1.1热性能规格............................................. ............................................. 75
5.1.2热计量............................................. .................................................. .. 79
处理器散热功能............................................... ............................................... 79
5.2.1热Monitor..................................................................................................... 79
5.2.2温度监控2 ............................................ .................................................. .... 80
电气规格................................................................................................................. 15
2.4
2.5
2.6
2.7
2.8
2.9
2.10
2.11
2.12
2.13
3
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
4
4.1
4.2
5
5.1
包装机械产品规格............................................... ............................................... 35
土地上市和信号说明............................................. ............................................... 43
散热规格及设计注意事项............................................. ......................... 75
5.2
数据表
3