测试硬件简介---探针卡(prober card)
发布时间:2008/6/5 0:00:00 访问次数:3815
探针卡(prober card) 是晶圆测试(wafer test)中被测芯片和测试机之间的接口.
探针卡对前期测试的开发及后期量产测试的良率的保证都非常重要.
一.下面介绍一常见的几类探针卡。
1.blade type : under 70 pins,low speed
low current probing
probing at extreme temperatures: > 200ºc
rf probing: > 3 ghz
low cost
lead time 1 day
刀片式:结构稳定,抗干扰性好,可用于rf测试。
2.epoxy type ; <1000pins
large array /multi-dut probing
tight pitch applications
high temperature applications
lead time 4 weeks for new design
repeat order 2 weeks
环氧树脂(悬臂式):比较流行的一种卡,针间的pitch可以做的很小,
同一张卡里针的数量也做的比较多.
3.vertical type: >1000 pins or high speed
multi-dut probing
parallel and grid array probing capacities
high accuracy
high contact quality
by 32 parallel or above
lead time 10-12 weeks for new design
垂直式:一张卡了可以做的针的数量非常多,可以做几千个针。针定位精确,
和芯片上pad的接触效果好.
二.探针卡主要的供应商.
company location
k&s us/tw/china
cascade us
wwl us
formfactor us
probe2000 us
jem japan
mjc japan
tcl japan/china
thicom korea
siprox tw
probe technology tw
ktti tw
爱普升 tw
microprobe tw
mpi tw
metek tw
mms (mjc and mpi ) shanghai
kimpsion corp. tw
shanghai yiyuan shanghai
npcl cmai tw
探针卡对前期测试的开发及后期量产测试的良率的保证都非常重要.
一.下面介绍一常见的几类探针卡。
1.blade type : under 70 pins,low speed
low current probing
probing at extreme temperatures: > 200ºc
rf probing: > 3 ghz
low cost
lead time 1 day
刀片式:结构稳定,抗干扰性好,可用于rf测试。
2.epoxy type ; <1000pins
large array /multi-dut probing
tight pitch applications
high temperature applications
lead time 4 weeks for new design
repeat order 2 weeks
环氧树脂(悬臂式):比较流行的一种卡,针间的pitch可以做的很小,
同一张卡里针的数量也做的比较多.
3.vertical type: >1000 pins or high speed
multi-dut probing
parallel and grid array probing capacities
high accuracy
high contact quality
by 32 parallel or above
lead time 10-12 weeks for new design
垂直式:一张卡了可以做的针的数量非常多,可以做几千个针。针定位精确,
和芯片上pad的接触效果好.
二.探针卡主要的供应商.
company location
k&s us/tw/china
cascade us
wwl us
formfactor us
probe2000 us
jem japan
mjc japan
tcl japan/china
thicom korea
siprox tw
probe technology tw
ktti tw
爱普升 tw
microprobe tw
mpi tw
metek tw
mms (mjc and mpi ) shanghai
kimpsion corp. tw
shanghai yiyuan shanghai
npcl cmai tw
探针卡(prober card) 是晶圆测试(wafer test)中被测芯片和测试机之间的接口.
探针卡对前期测试的开发及后期量产测试的良率的保证都非常重要.
一.下面介绍一常见的几类探针卡。
1.blade type : under 70 pins,low speed
low current probing
probing at extreme temperatures: > 200ºc
rf probing: > 3 ghz
low cost
lead time 1 day
刀片式:结构稳定,抗干扰性好,可用于rf测试。
2.epoxy type ; <1000pins
large array /multi-dut probing
tight pitch applications
high temperature applications
lead time 4 weeks for new design
repeat order 2 weeks
环氧树脂(悬臂式):比较流行的一种卡,针间的pitch可以做的很小,
同一张卡里针的数量也做的比较多.
3.vertical type: >1000 pins or high speed
multi-dut probing
parallel and grid array probing capacities
high accuracy
high contact quality
by 32 parallel or above
lead time 10-12 weeks for new design
垂直式:一张卡了可以做的针的数量非常多,可以做几千个针。针定位精确,
和芯片上pad的接触效果好.
二.探针卡主要的供应商.
company location
k&s us/tw/china
cascade us
wwl us
formfactor us
probe2000 us
jem japan
mjc japan
tcl japan/china
thicom korea
siprox tw
probe technology tw
ktti tw
爱普升 tw
microprobe tw
mpi tw
metek tw
mms (mjc and mpi ) shanghai
kimpsion corp. tw
shanghai yiyuan shanghai
npcl cmai tw
探针卡对前期测试的开发及后期量产测试的良率的保证都非常重要.
一.下面介绍一常见的几类探针卡。
1.blade type : under 70 pins,low speed
low current probing
probing at extreme temperatures: > 200ºc
rf probing: > 3 ghz
low cost
lead time 1 day
刀片式:结构稳定,抗干扰性好,可用于rf测试。
2.epoxy type ; <1000pins
large array /multi-dut probing
tight pitch applications
high temperature applications
lead time 4 weeks for new design
repeat order 2 weeks
环氧树脂(悬臂式):比较流行的一种卡,针间的pitch可以做的很小,
同一张卡里针的数量也做的比较多.
3.vertical type: >1000 pins or high speed
multi-dut probing
parallel and grid array probing capacities
high accuracy
high contact quality
by 32 parallel or above
lead time 10-12 weeks for new design
垂直式:一张卡了可以做的针的数量非常多,可以做几千个针。针定位精确,
和芯片上pad的接触效果好.
二.探针卡主要的供应商.
company location
k&s us/tw/china
cascade us
wwl us
formfactor us
probe2000 us
jem japan
mjc japan
tcl japan/china
thicom korea
siprox tw
probe technology tw
ktti tw
爱普升 tw
microprobe tw
mpi tw
metek tw
mms (mjc and mpi ) shanghai
kimpsion corp. tw
shanghai yiyuan shanghai
npcl cmai tw
上一篇:测试入门简介
上一篇:无铅焊料表面贴装焊点的可靠