其它现货产品还有：
XT25W1GBSFIGA
1Gbit 1.65~3.6V -40℃~85℃ SOP16 300mil Standard, Dual, Quad I/O
NOR MCP
芯天下技术XT70系列是多芯片合封（MCP）存储解决方案，包含一颗串行NOR闪存芯片和一颗串行PSRAM芯片，这种不同类型存储器的单颗整合设计方案带来很多优势：
1. 减少终端产品 PCB板设计面积的同时提升数据访问速度；
2. 扩充SOC内嵌Flash和SRAM的容量不足，灵活配置满足个性化需求；
3. LGA16 5x6mm 小型化封装适配模组和穿戴设备的空间不足；
这种小型化、高性能的MCP适用于支持快速访问的音视频智能模块，穿戴和IOT产品。
型号 容量电压温度封装描述包装状态说明书
XT70F64B64ALGIGA 64M64M2.7~3.6V-40℃~85℃LGA16 6x5mm64M NOR + 64M Psram
XT70F128B64ALGIGA
128M64M 2.7~3.6V -40℃~85℃ LGA16 6x5mm 128M NOR + 64M Psram
XT26G01CWSIGA
1Gbit 2.7~3.6V -40℃~85℃ WSON8 8x6mm 8bit ECC always on, 4 bit ECC status, Max 104MHz
XT26G11CWSIGA-B
1Gbit 2.7~3.6V -40℃~85℃ WSON8 8x6mm 14bit ECC default on, 2 bit ECC status, Max 104Mhz
XT26G01DWSIGA
XT26G01CWSIGT
XT26G11CWSIGA
1Gbit 2.7~3.6V -40℃~85℃ WSON8 8x6mm 8bit ECC default on, 2 bit ECC status, Max 104MHz
XT26Q01CWSIGA
1Gbit 1.7~1.95V -40℃~85℃ WSON8 8x6mm 8bit ECC always on, 4 bit ECC status, Max 104MHz
XT26Q02ELGIGA
2Gbit 1.7~1.95V -40℃~85℃ LGA8 8x6mm 8bit ECC default on, 3 bit ECC status, Max 133Mhz, 2 plane
XT26G02CWSIGA
2Gbit 2.7~3.6V -40℃~85℃ WSON8 8x6mm 8bit ECC always on, 4 bit ECC status, Max 104MHz
XT26G02ELGIGA
2Gbit 2.7~3.6V -40℃~85℃ LGA8 8x6mm 8bit ECC default on, 3 bit ECC status, Max 133MHz, 2 plane
XT26G02EBGIGA
2Gbit 2.7~3.6V -40℃~85℃ BGA24 6x8mm 8bit ECC default on, 3 bit ECC status, Max 133MHz, 2 plane
XT26G04CWSIGA
4Gbit 2.7~3.6V -40℃~85℃ WSON8 8x6mm 8bit ECC always on, 4 bit ECC status, Max 104MHz
XT26Q04CWSIGA
4Gbit 1.7~1.95V -40℃~85℃ WSON8 8x6mm 8bit ECC always on, 4 bit ECC status, Max 104MHz
PN27G01ABGITG
1Gbit 2.7~3.6V -40℃~85℃ BGA24 6x8mm 8 bit ECC required
1Gbit 2.7~3.6V -40℃~85℃ BGA24 6x8mm Build with 8bit/528byte ECC engine
XT27G01ATSIGA
1Gbit 2.7~3.6V -40℃~85℃ TSOP48 12x20x1.2mm 8 bit ECC required
XT27G01BTSIGA
1Gbit 2.7~3.6V -40℃~85℃ TSOP48 12x20x1.2mm Build with 8bit/528byte ECC engine
PN27Q01ABGITG
1Gbit 1.7~1.95V -40℃~85℃ BGA24 6x8mm 8bit ECC Required
PN27Q01BBGITG
1Gbit 1.7~1.95V -40℃~85℃ BGA24 6x8mm Build with 8bit/528byte ECC engine
PN27G02ABGITG
2Gbit 2.7~3.6V -40℃~85℃ BGA24 6x8mm 8 bit ECC required
PN27G02BBGITG
2Gbit 2.7~3.6V -40℃~85℃ BGA24 6x8mm Build with 8bit/528byte ECC engine
XT27G02ATSIGA
2Gbit 2.7~3.6V -40℃~85℃ TSOP48 12x20x1.2mm 8 bit ECC required
XT27G02BTSIGA
2Gbit 2.7~3.6V -40℃~85℃ TSOP48 12x20x1.2mm Build with 8bit/528byte ECC engine
PN27Q02BBGITG
2Gbit 1.7~1.95V -40℃~85℃ BGA24 6x8mm Build with 8bit/528byte ECC engine
PN27G04ABGITG
4Gbit 2.7~3.6V -40℃~85℃ BGA24 6x8mm 8bit ECC Required
XT27G04CTSIGA
4Gbit 2.7~3.6V -40℃~85℃ TSOP48 12x20x1.2mm Build with 4bit/528byte ECC engine
XT27G04CBSIGA
4Gbit 2.7~3.6V -40℃~85℃ BGA63 11x9x1.0mm Build with 4bit/528byte ECC engine
XT27G04A8BFIGA
4Gbit 2.7~3.6V -40℃~85℃ BGA67 8x6.5x0.89mm 8 bit ECC required
XT27G04ATSIGA
4Gbit 2.7~3.6V -40℃~85℃ TSOP48 12X20X1.2mm 8 bit ECC required
XT27G04ABSIGA
4Gbit 2.7~3.6V -40℃~85℃ BGA63 11x9x0.88mm 8 bit ECC required
XTSD01GLGEAG
1Gbit 2.7~3.6V -30℃~85℃ LGA8 8x6mm SD 2.0,
Embedded SD NAND MP
XTSDG01GWSIGA
1Gbit 2.7~3.6V -30℃~85℃ WSON8 8x6mm SD 2.0,
Embedded SD NAND UD
XTSD01GLGEAG-D
XTSD02GLGEAG
2Gbit 2.7~3.6V -30℃~85℃ LGA8 8x6mm SD 2.0,
XTSD04GCLGEGA
4Gbit 2.7~3.6V -30℃~85℃ LGA8 8x6mm SD 2.0,
XTSD04GLGEAG
XTSD08GLGEAG XT95F636KPMC-G-UNE2
36Kbyte 2.88~
XT95F698KPMC1-G-UNE2
60Kbyte 2.88~5.5V -40℃~85℃ LQFP52 10X10mm 8bit flash based MCU
XT95F698KPMC2-G-UNE2
60Kbyte 2.88~5.5V -40℃~85℃ LQFP44 10X10mm 8bit flash based MCU
5.5V -40℃~85℃ LQFP32 7X7mm 8bit flash based MCU
FT802
SOT23-5 Sync Buck 2 2.5 5.5 Consumer
FT801
SOT23-5 Sync Buck 1 2.5 5.5 Consumer
XTP8012AS2CT
XTP8011AS2CT
SOT23-5 Sync Buck 1 2.5 5.5
XTP2021-330AS2CT
1.8 5.5 76 300 1
XTP2021-300AS2CT
XTP2021-290AS2CT
XTP2021-285AS2CT
XTP2021-280AS2CT
XTP2021-270AS2CT
XTP2021-250AS2CT
