AT91SAM9G35-CU

EP3C120F484I7N ALTERA/阿尔特拉 21+ BGA
EP3C16F256I7N ALTERA/阿尔特拉 21+ BGA
EP3C40F780C8N ALTERA/阿尔特拉 21+ BGA
EP3C5F256C8N ALTERA/阿尔特拉 21+ BGA
EP4CE10U14I7N ALTERA/阿尔特拉 21+ BGA
EP4CE40F23C8N ALTERA/阿尔特拉 21+ BGA
EP4CE6F17C8N ALTERA/阿尔特拉 21+ BGA
EP4CE75F23I7N ALTERA/阿尔特拉 21+ BGA
EP4CE75U19I7N ALTERA/阿尔特拉 21+ BGA
EP4CGX15BF14C8N ALTERA/阿尔特拉 21+ BGA
EP4CGX75CF23I7N ALTERA/阿尔特拉 21+ BGA
EPM1270F256C5 ALTERA/阿尔特拉 21+ BGA
EPM1270F256C5N ALTERA/阿尔特拉 21+ BGA
EPM2210F324C5N ALTERA/阿尔特拉 21+ BGA
EPM570F256C5N ALTERA/阿尔特拉 21+ BGA
EPM570F256I5N ALTERA/阿尔特拉 21+ BGA
ICE3PCS03G INFINEON/英飞凌 21+ BGA
MAX24025IMP+T MAXIM/美信 21+ BGA
MAX7366ACWJ+T MAXIM/美信 21+ BGA
MAX9218ECM MAXIM/美信 21+ BGA
MT27C2G24MAAMAHANE-6 MICREL/麦瑞 21+ BGA
AT91SAM9G35-CU MICROCHIP/微芯 21+ BGA
AT91SAM9G45C-CU MICROCHIP/微芯 21+ BGA
AT91SAM9X35-CU MICROCHIP/微芯 21+ BGA
VSC8512XJG-03 MICROCHIP/微芯 21+ BGA
LPC1768FET100 NXP/恩智浦 21+ BGA
MCIMX283DVM4B NXP/恩智浦 21+ BGA
MCIMX287CVM4B NXP/恩智浦 21+ BGA
MCIMX6D6AVT08AD NXP/恩智浦 21+ BGA
MCIMX6D6AVT10AD NXP/恩智浦 21+ BGA
MCIMX6G2AVM05AB/ NXP/恩智浦 21+ BGA
MCIMX6Q5EYM10AD NXP/恩智浦 21+ BGA
MCIMX6Q6AVT10AD NXP/恩智浦 21+ BGA
MCIMX6Q6AVT10AE NXP/恩智浦 21+ BGA
MCIMX6S5EVM10AC NXP/恩智浦 21+ BGA
MCIMX6S6AVM08AC NXP/恩智浦 21+ BGA
MCIMX6U5DVM10AC NXP/恩智浦 21+ BGA
MCIMX6Y2DVM05AB NXP/恩智浦 21+ BGA
MIMX8ML8CVNKZAB NXP/恩智浦 21+ BGA
是否Rohs认证符合生命周期TransferredObjectid1101540908零件包装代码BGA包装说明LFBGA, BGA217,17X17,32针数217Reach Compliance CodecompliantECCN代码3A991.A.2HTS代码8542.31.00.01风险等级7.81地址总线宽度26位大小32边界扫描YES最大时钟频率50 MHz外部数据总线宽度32格式FIXED POINT集成缓存YESJESD-30 代码S-PBGA-B217长度15 mm低功率模式YES端子数量217最高工作温度85 °C最低工作温度-40 °C封装主体材料PLASTIC/EPOXY封装代码LFBGA封装等效代码BGA217,17X17,32封装形状SQUARE封装形式GRID ARRAY, LOW PROFILE, FINE PITCH电源1,1.8/3.3,3.3 V认证状态Not Qualified座面最大高度1.4 mm速度400 MHz子类别Microprocessors最大供电电压1.1 V最小供电电压0.9 V标称供电电压1 V表面贴装YES技术CMOS温度等级INDUSTRIAL端子形式BALL端子节距0.8 mm端子位置BOTTOM宽度15 mmuPs/uCs/外围集成电路类型MICROPROCESSOR, RISC