K4-06详细规格
- 类别:热 - 垫,片
- 描述:THERMAL PAD 0.006" K4
- 系列:Sil-Pad® K-4
- 制造商:Bergquist
- 应用:TO-220
- 形状:-
- 外形:-
- 厚度:0.006"(0.152mm)
- 材料:硅质
- 粘合剂:-
- 底布qqq载体:Kapton?
- 颜色:灰
- 热阻率:0.48°C/W
- 导热率:0.9 W/m-K
- 配件 Omron Electronics Inc-IA Div SENS PWR SUP 10VDC W/ANALOG VOLT
- 标签,标记 Panduit Corp LABEL INK JET CLOTH 1.44 X .5"
- 过时/停产零件编号 Logic CABLE DISP FOR AMD GEODE LX
- 热 - 垫,片 Bergquist 径向 THERMAL PAD MULTI W/ADH .006" K4
- 晶体 ECS Inc HC49/US CRYSTAL 20.000MHZ SERIES SMD
- 线性 - 音頻放大器 Texas Instruments 4-XFBGA IC PREAMP AUDIO MONO MIC 4USMD
- 标签,标记 Panduit Corp LABEL INK JET PLYLFN 1.38X.19"
- 配件 Omron Electronics Inc-IA Div RELAY OUTPT BOARD HI/LO FOR K3HB
- Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps Texas Instruments 8-WFDFN 裸露焊盘 IC AMP DIFF 1.5GHZ 1CN 8-LLP
- 配件 Logic CABLE DISP FREESCALE M5475,85EVB
- 线性 - 音頻放大器 Texas Instruments 4-XFBGA IC AMP AUDIO MONO AB MIC 4USMD
- 晶体 ECS Inc HC49/US CRYSTAL 20.000 MHZ SER 49US
- 标签,标记 Panduit Corp LABEL INK JET PAPER .25 X 1"
- 配件 Omron Electronics Inc-IA Div DEVICENET MODULE FOR K3HB
- Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps Texas Instruments 8-SOIC(0.154",3.90mm Width)裸露焊盘 IC AMP DIFF 900MHZ W/CLAMP 8PSOP