HSTTT112-48-5 全国供应商、价格、PDF资料
HSTTT112-48-5详细规格
- 类别:热缩管
- 描述:HEAT SHRINK TFE POLY 1 1/8" X 4’
- 系列:HSTT
- 制造商:Panduit Corp
- 值:
- 直径:
- 颜色:透明
- 包装:
HSTTT112-48-5详细规格
- 类别:热缩管
- 描述:HEAT SHRINK TFE POLY 1 1/8" X 4’
- 系列:HSTT
- 制造商:Panduit Corp
- 类型:套管,半刚性
- 收缩率:2 至 1
- 长度:4.00’(1.22m)
- 内径(出厂):1.120"(26.6mm)
- 内径_恢复后:0.786"(20.0mm)
- 恢复后的壁厚:0.025"(0.64mm)
- 材料:聚四氟乙烯(PTFE,Teflon?)
- 特性:-
- 颜色:透明
- 工作温度:-67°C ~ 250°C
- 收缩温度:-
- 配件 Lattice Semiconductor Corporation 672-BBGA INTERFACE CARD ECP3 IO ADC-DAC
- 存储器 IDT, Integrated Device Technology Inc 100-LQFP IC SRAM 128KBIT 20NS 100TQFP
- 热缩管 Panduit Corp HEAT SHRINK SEMI RGD 3/8" X 4’
- 时钟/计时 - 专用 IDT, Integrated Device Technology Inc 28-SSOP(0.209",5.30mm 宽) IC CLK BUFF 4OUT DIFF 28SSOP
- 压力 Honeywell Sensing and Control 4-SIP SENSOR PRESS 1PSI DIFF 3.3V SIP
- 陶瓷 AVX Corporation 1812(4532 公制) CAP CER 1000PF 3KV 10% X7R 1812
- 时钟/计时 - 时钟发生器,PLL,频率合成器 IDT, Integrated Device Technology Inc 8-SOIC(0.154",3.90mm 宽) IC PLL BUILDING BLOCK 8-SOIC
- 配件 Lattice Semiconductor Corporation ACCY USB DOWNLOAD CABLE STD SPD
- 配件 Lattice Semiconductor Corporation 672-BBGA INTERFACE CARD ECP3 IO ADC-DAC
- 压力 Honeywell Sensing and Control 4-SIP,双端口,同侧 SENSOR PRES 1PSI DIFF 3.3V SIP
- 时钟/计时 - 专用 IDT, Integrated Device Technology Inc 28-SSOP(0.209",5.30mm 宽) IC CLK BUFF 4OUT DIFF 28SSOP
- 线性 - 视频处理 IDT, Integrated Device Technology Inc 16-TSSOP(0.173",4.40mm 宽) IC CLK SOURCE DGTL VIDEO 16TSSOP
- 陶瓷 AVX Corporation 1825(4564 公制) CAP CER 10000PF 1KV 10% X7R 1825
- 通用嵌入式开发板和套件(MCU、DSP、FPGA、CPLD等) Xilinx Inc EVALUATION PLATFORM VIRTEX-4
- 通用嵌入式开发板和套件(MCU、DSP、FPGA、CPLD等) Freescale Semiconductor KIT EVAL UNIVERSITY S12 LAB I