HSP-3详细规格
- 类别：热 - 垫，片
- 描述：THERMAL PAD TRIPLE PHASE
- 系列：HSP
- 制造商：Crydom Co.
- 应用：三相 SSR
- 形状：矩形
- 外形：104.39mm x 73.66mm
- 厚度：0.003"（0.076mm）
- 材料：-
- 粘合剂：-
- 底布qqq载体：-
- 颜色：白
- 热阻率：-
- 导热率：1.0 W/m-K
- Card Edge, Edgeboard Connectors Sullins Connector Solutions CONN EDGECARD 62POS .156 WW
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- 热 - 垫，片 Crydom Co. SOT-563，SOT-666 THERMAL PAD SNGL PHASE WADHESVE
- 配件 Texas Instruments 8-SOIC（0.154"，3.90mm Width）裸露焊盘 BOARD INTERFACE FOR HPA-MCU
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- RF 评估和开发套件，板 Honeywell Microelectronics & Precision Sensors 16-VQFN BOARD EVALUATION FOR HRF-AT4520
- 配件 Omron Electronics Inc-IA Div 模块 DETECTOR CURRENT 0-50A 12MM DIA
- Card Edge, Edgeboard Connectors Sullins Connector Solutions CONN EDGECARD 62POS .156 EXTEND
- 配件 Texas Instruments 8-SOIC（0.154"，3.90mm Width）裸露焊盘 BOARD INTERFACE FOR HPA-MCU
- 加热元件检测器 Omron Electronics Inc-IA Div 径向 DETECTR HEATR FALT 110-220V 2-4A
- Card Edge, Edgeboard Connectors Sullins Connector Solutions CONN EDGECARD 26POS DIP .100 SLD
- 配件 Omron Electronics Inc-IA Div 模块 TRANSFORMER CURRENT 12MM DIA
- RF 评估和开发套件，板 Honeywell Microelectronics & Precision Sensors 16-VQFN 裸露焊盘 BOARD EVALUATION FOR HRF-AT4610
- Card Edge, Edgeboard Connectors Sullins Connector Solutions CONN EDGECARD 62POS DIP .156 SLD
010-62962871、 
171-4755-1968 
0755-83223003 
0755-22655674 
171-4729-9698 
010-62962871、 
021-51872165/ 
021-51872165/ 
0755-83258002 
0755-83035161 
13910052844（微 
