HBM28DSXN详细规格
- 类别:Card Edge, Edgeboard Connectors
- 描述:CONN EDGECARD 56POS DIP .156 SLD
- 系列:-
- 制造商:Sullins Connector Solutions
- 卡类型:非指定 - 双边
- 公母:母头
- 位/盘/排数:28
- 针脚数:56
- 卡厚度:0.062"(1.57mm)
- 排数:2
- 间距:0.156"(3.96mm)
- 特性:-
- 安装类型:通孔
- 端接:焊接
- 触头材料:铜铍
- 触头镀层:金
- 触头镀层厚度:10µin(0.25µm)
- 触头类型:全波纹管
- 颜色:蓝
- 包装:托盘
- 法兰特性:-
- 标签,标记 Panduit Corp LABEL INK JET POLYEST.25 X 1.5"
- Card Edge, Edgeboard Connectors Sullins Connector Solutions CONN EDGECARD 56POS .156 EXTEND
- 板对板 - 阵列,边缘类型,包厢 JAE Electronics 16-SOIC(0.295",7.50mm 宽) CONN HEADER 50POS 0.5MM SMD
- 存储器 Micron Technology Inc 56-TFSOP(0.724",18.40mm 宽) IC FLASH 256MBIT 110NS 56TSOP
- Card Edge, Edgeboard Connectors Sullins Connector Solutions CONN EDGECARD 86POS DIP .156 SLD
- 通孔电阻器 Vishay Dale 轴向 RES 180 OHM 3.25W 5% WW AXIAL
- 陶瓷 Vishay BC Components 径向,圆盘 CAP CER 1000PF 1KV 10% RADIAL
- 存储器 Micron Technology Inc 56-TFSOP(0.724",18.40mm 宽) IC FLASH 256MBIT 95NS 56TSOP
- 板对板 - 阵列,边缘类型,包厢 JAE Electronics 16-SOIC(0.295",7.50mm 宽) CONN RCPT 100POS 0.5MM SMD
- Card Edge, Edgeboard Connectors Sullins Connector Solutions CONN EDGECARD 86POS .156 EXTEND
- 通孔电阻器 Vishay Dale 轴向 RES 18 OHM 3.25W 5% WW AXIAL
- 陶瓷 Vishay BC Components 径向,圆盘 CAP CER 1000PF 1KV 20% RADIAL
- 板对板 - 阵列,边缘类型,包厢 JAE Electronics 16-SOIC(0.295",7.50mm 宽) CONN HEADER 20POS 0.5MM SMD
- 存储器 Micron Technology Inc 56-TFSOP(0.724",18.40mm 宽) IC FLASH 512MBIT P33 65NM 56TSOP
- 标签,标记 Panduit Corp LABEL INK JET POLYEST .38X1.88"