85862-2详细规格
- 类别:矩形 - 触点
- 描述:CONN SOCKET CONTACT GOLD PCB
- 系列:AMPMODU Mod II
- 制造商:TE Connectivity
- 类型:-
- 引脚或插座:插口
- 触头端接:焊接,PCB
- 线规:-
- 触头镀层:金
- 触头镀层厚度:30µin(0.76µm)
- 包装:带卷 (TR)
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- 陶瓷 TDK Corporation 0603(1608 公制) CAP CER 0.1UF 50V 20% X5R 0603
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