1879657-6详细规格
- 类别:通孔电阻器
- 描述:RES 11.3 OHM 1/2W 0.1% AXIAL
- 系列:H4, Holsworthy
- 制造商:TE Connectivity
- 电阻333Ω444:11.3
- 功率333W444:0.5W,1/2W
- 成分:金属薄膜
- 特性:脉冲耐受
- 温度系数:±15ppm/°C
- 容差:±0.1%
- 封装/外壳:轴向
- 供应商器件封装:轴向
- 大小/尺寸:0.146" 直径 x 0.394" L(3.70mm x 10.00mm)
- 高度:-
- 端子数:2
- 包装:散装
- 嵌入式 - FPGA(现场可编程门阵列) Microsemi SoC 80-TQFP IC FPGA MX SGL CHIP 6K 80-VQFP
- 矩形- 接头,公引脚 Molex Connector Corporation 80-TQFP CONN HEADER 40POS .100"R/A GOLD
- 通孔电阻器 TE Connectivity 轴向 RES 10.2 OHM 1/2W 0.1% AXIAL
- DIP Omron Electronics Inc-EMC Div 轴向 SWITCH DIP 4POS TOP ACT GULLEAD
- 可插式 3M 轴向 CABLE TWINAX MINISAS 68POS .8M
- 长方形 - 弹簧加载 Mill-Max Manufacturing Corp. 轴向 CONN SPRING 48POS DUAL .177 PCB
- 陶瓷 AVX Corporation [MIL] 堆栈式 DIP,8 个接脚 CAP CER 6.8UF 100V 10% RADIAL
- Card Edge, Edgeboard Connectors TE Connectivity 堆栈式 DIP,8 个接脚 CONN PCI EXPRESS 164POS VERT
- 矩形 - 外壳 Molex Connector Corporation 堆栈式 DIP,8 个接脚 CONN HOUSING 2POS .100" SINGLE
- DIP Omron Electronics Inc-EMC Div 轴向 SWITCH DIP 4POS RAISED SMD
- 矩形- 接头,插座,母插口 Preci-Dip 轴向 SMD SOCKET LOW PRO SINGLE ROW
- 长方形 - 弹簧加载 Mill-Max Manufacturing Corp. 轴向 CONN SPRING 50POS DUAL .177 PCB
- 矩形 - 触点 TE Connectivity 轴向 CONN SOCKET 22-26AWG 30AU CRIMP
- 矩形 - 外壳 TE Connectivity 轴向 CONN HOUSING 12POS .100 DUAL ROW
- 矩形 - 外壳 Molex Connector Corporation 轴向 CONN HOUSING 5POS .100" SINGLE