1-146470-7 全国供应商、价格、PDF资料
1-146470-7详细规格
- 类别:面板至面板 - 面板衬垫,堆叠器
- 描述:CONN HEADER 17POS STACKNG 15GOLD
- 系列:AMPMODU Mod II
- 制造商:TE Connectivity
- 针脚数:17
- 间距:0.100"(2.54mm)
- 排数:1
- 排距:-
- 长度_总:1.030"(26.16mm)
- 长度_柱(配接):0.330"(8.38mm)
- 长度_堆叠高度:0.370"(9.40mm)
- 长度_焊尾:0.330"(8.38mm)
- 安装类型:通孔
- 端接:焊接
- 触头镀层_柱(配接):金
- 触头镀层厚度_柱(配接):15µin(0.38µm)
- 颜色:黑
- 包装:散装
- 同轴,RF Amphenol Connex DO-201AA,DO-27,轴向 CONN SMA JACK R/A PCB BULKHD
- 同轴,RF Amphenol-RF Division DO-201AA,DO-27,轴向 CONN TNC JACK BLKHD CRIMP
- 矩形- 接头,公引脚 TE Connectivity DO-201AA,DO-27,轴向 CONN HDR BRKWAY 22POS .100 DUAL
- 其它 Molex Connector Corporation DO-201AA,DO-27,轴向 MAGNETIC MOUNT ASSEMBLY
- 背板 - DIN 41612 Conec DO-201AA,DO-27,轴向 48 POS FEMALE TYPE E W/W A+C+E
- 配件 APM Hexseal DO-201AA,DO-27,轴向 BOOT HALF TOGGLE M5-0.5 THD BLK
- 固定式 API Delevan Inc 轴向 COIL .15UH MOLDED UNSHIELDED
- TVS - 二极管 Vishay Semiconductor Diodes Division DO-201AA,DO-27,轴向 TVS UNIDIR 1.5KW 91V 10% 1.5KE
- 同轴,RF Amphenol Connex DO-201AA,DO-27,轴向 CONN SMA JACK R/A PCB BULKHD R/P
- 其它 Molex Connector Corporation MAGNETIC MOUNT ASSEMBLY
- 配件 APM Hexseal BOOT HALF TOGGLE M5-0.5 THD BLK
- 箱 Serpac BOX 4.10X2.60X2.00 ALMOND
- D形,Centronics 3M CONN MDR RECEPT 50POS R/A SMD
- 同轴,RF Amphenol-RF Division CONN PLUG BNC CRIMP RG179,187
- TVS - 二极管 Diodes Inc DO-201AA,DO-27,轴向 TVS BIDIR 1500W V DO-201A