EPM240F100I5N参数如下：
零件包装代码 BGA
包装说明 11 X 11 MM, 1 MM PITCH, LEAD FREE, FBGA-100
针数 100
Reach Compliance Code unknown
ECCN代码 EAR99
HTS代码 8542.39.00.01
风险等级 3.8
其他特性 IT CAN ALSO OPERATE AT 3.3V
系统内可编程 YES
JESD-30 代码 S-PBGA-B100
JESD-609代码 e1
JTAG BST YES
长度 11 mm
湿度敏感等级 3
专用输入次数
I/O 线路数量 80
宏单元数 192
端子数量 100
组织 0 DEDICATED INPUTS, 80 I/O
输出函数 MACROCELL
封装主体材料 PLASTIC/EPOXY
封装代码 LBGA
封装等效代码 BGA100,10X10,40
封装形状 SQUARE
封装形式 GRID ARRAY, LOW PROFILE
峰值回流温度（摄氏度） 260
电源 1.5/3.3,2.5/3.3 V
可编程逻辑类型 FLASH PLD
传播延迟 7.5 ns
认证状态 Not Qualified
座面最大高度 1.7 mm
子类别 Programmable Logic Devices
最大供电电压 2.625 V
最小供电电压 2.375 V
标称供电电压 2.5 V
表面贴装 YES
技术 CMOS
端子面层 Tin/Silver/Copper (Sn/Ag/Cu)
端子形式 BALL
端子节距 1 mm
端子位置 BOTTOM
处于峰值回流温度下的最长时间 40
宽度 11 mm
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