USB2514B-AEZG
USB3343-CP-TR
USB3300-EZK
USB3319C-CP-TR
USB3317C-CP-TR
LAN9220-ABZJ
LAN8710A-EZK-TR
LAN8720A-CP-TR
LAN9303-ABZJ
Descriptions
The USB3300 is an industrial temperature Hi-Speed USB Physical Layer Transceiver (PHY). The USB3300 uses a low pin count interface (ULPI) to connect to a ULPI compliant Link layer. The ULPI interface reduces the UTMI+ interface from 54 pins to 12 pins using a method of in-band signaling and status byte transfers between the Link and PHY.
This PHY was designed from the start with the ULPI interface. No UTMI to ULPI wrappers are used in this design which provides a seamless ULPI to Link interface. The result is a PHY with a low latency transmit and receive time. SMSC's low latency high speed and full speed receiver provide the option of re-using existing UTMI Links with a simple wrapper to convert UTMI to ULPI.
The ULPI interface allows the USB3300 PHY to operate as a device, host, or an On-The-Go (OTG) device. Designs using the USB3300 PHY as a device, can add host and OTG capability at a later date with no additional pins.
The ULPI interface, combined with SMSC's proprietary technology, makes the USB3300 the ideal method of adding Hi-Speed USB to new designs. The USB3300 features an industry leading small footprint package (5mm by 5mm) with sub 1mm height. In addition the USB3300 integrates all DP and DM termination resistances and requires a minimal number of external com
Features
USB-IF Hi-Speed certified to the Universal Serial Bus Specification Rev 2.0
Interface compliant with the ULPI Specification revision 1.1 in 8-bit mode
Industry standard UTMI+ Low Pin Interface (ULPI) Converts 54 UTMI+ signals into a standard 12 pin Link controller interface
54.7mA Unconfigured Current (typical) - ideal for bus powered applications
83uA suspend current (typical) - ideal for battery powered applications
Latch-Up performance exceeds 150 mA per EIA/JESD 78, Class II
ESD protection levels of ±8kV HBM without external protection devices
Integrated protection to withstand IEC61000-4-2 ESD tests (±8kV contact and ±15kV air) per 3rd party test facility
Supports FS pre-amble for FS hubs with a LS device attached (UTMI+ Level 3)
Supports HS SOF and LS keep-alive pulse
Includes full support for the optional On-The-Go (OTG) protocol detailed in the On-The-Go Supplement Revision 1.0a specification
Supports the OTG Host Negotiation Protocol (HNP) and Session Request Protocol (SRP)
Allows host to turn VBUS off to conserve battery power in OTG applications
Supports OTG monitoring of VBUS levels with internal comparators. Includes support for an external VBUS or fault monitor.
Low Latency Hi-Speed Receiver (43 Hi-Speed clocks Max) allows use of legacy UTMI Links with a ULPI wrapper
Integrated Pull-up resistor on STP for interface protection allows a reliable Link/PHY start-up with slow Links (software configured for low power)
Internal 1.8 volt regulators allow operation from a single 3.3 volt supply
Internal short circuit protection of ID, DP and DM lines to VBUS or ground
Integrated 24MHz Crystal Oscillator supports either crystal operation or 24MHz external clock input
Internal PLL for 480MHz Hi-Speed USB operation
Industrial Operating Temperature -40°C to +85°C
32 pin, QFN lead-free RoHS Compliant package (5 x 5 x 0.90 mm height)
Applications
STB
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在拍摄方面，搭载骁龙888的Redmi K40 Pro和K40 Pro+也带来顶级计算摄影体验。骁龙888采用全新Qualcomm Spectra™580 ISP，能够支持突破性的每秒27亿像素的处理速度，顶级计算摄影性能搭配第六代高通AI引擎带来的高达26 TOPS的惊人算力，为Redmi K40 Pro和Pro+带来堪比“夜视仪”的超强夜景拍摄能力，支持拍摄清晰明亮的画面并保留丰富的细节。骁龙888的顶级AI性能为Redmi K40 Pro和K40 Pro+实现更多丰富有趣的拍摄特性提供强大算力支持，用户可以使用这两款产品实现魔法分身、魔法换天、电影级滤镜等多种AI特效，AI美颜相机支持的美白、磨皮、素颜美妆、3D立体塑形和发际线填充等实用小功能也不在话下。此外，以往需要专业后期才能实现的效果，如定格分身和时间静止功能，Redmi K40系列上可以一键轻松实现。
在连接方面，除了支持5G，Redmi K40 Pro和K40 Pro+的Wi-Fi性能也进一步“升杯”。其搭载的骁龙888采用全新高通FastConnect 6900移动连接系统，支持先进的Wi-Fi 6增强版，其最大理论速率高达3.5Gbps，配合Wi-Fi 6增强版路由器能够体验目前最快的Wi-Fi速度，即便在多设备的复杂网络环境中，也能尽享高速且低时延的稳定网络连接。
