10月24日，三星电子宣布：率先开始量产12G容量、基于UFS的LPDDR4X多芯片内存。详情如下：1、该内存由24G LPDDR4X小芯片组成。2、1Ynm制程。3、总共4颗封装一起。4、突破了当前8G总容量的封装限制。
在空间寸土寸金的智能手机尤其是高端手机内部，12G RAM仅需一颗整合芯片就能做到后，将为其它元件如电池、CMOS等释放更多空间。另外，这也为手机RAM容量进一步提高埋下了伏笔。三星还称：将会进一步扩大10G LPDDR内存芯片的出货，以满足市场需求。
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