k xilinx kintex<ultrascale+}现场可编程阵列（fpa）具有多种电源选择，可以在要求的系统性能和非常低的功耗之间达到最佳平衡。fpga是一种基于可配置逻辑块（clb）矩阵的半导体器件，通过可编程互连系统连接。Kintex UltraScale+设备是数据包处理和DSP密集型功能的理想选择，适用于从无线mimo技术到NX100G网络和数据中心的各种应用。
特性
可编程系统集成
高达1.2m的系统逻辑单元
用于片上存储器集成的UltraRAM集成100G以太网MAC以支持RS-FEC和150G因特拉肯内核
提高系统性能
o.3 teramac dsp计算性能
与kintex-7fpga相比，系统级性能功率比提高了两倍以上。
o 16G和28G背板-支持各种收发器
o中速级支持2666MB/s DDR4
降低物料清单成本
o 12.5gb/s最低速度等极收发器
集成vcxo和fpll可以降低时钟组件的成本。
降低总功耗
o.与7系列FPGAs相比，功耗降低了60%
o.电压缩放选项支持高性能和低功耗
o.使用紧凑的逻辑单元封装以降低动态功耗
提高设计生产力
o使用vivado设计套件进行协作优化，以加速设计收敛
智能连接技术在智能ip集成中的应用
112mhz点对点mwr调制解调器及数据包处理
_ 1GHz宽带调制解调器和数据包处理
1. Kintex UltraScale + product advantages such as: XCKU9P-L1FFVE900I
K Xilinx Kintex < UltraScale+} Field Programmable Array (FPA) has a variety of power options, which can achieve the best balance between the required system performance and very low power consumption. The FPGA is a semiconductor device based on a configurable logic block (CLB) matrix connected through a programmable interconnection system. Kintex UltraScale + devices are ideal for data packet processing and DSP-intensive functions, and are suitable for applications ranging from wireless MIMO technology to Nx100G network and data center.
Characteristic
Programmable System Integration
Up to 1.2M System Logic Unit
UltraRAM for on-chip memory integrationO Integrating 100G Ethernet MAC to support RS-FEC and 150G Interlaken Kernel
Improving system performance
O.3 TeraMAC DSP Computing Performance
O. Compared with Kintex-7 FPGA, the system-level performance-power ratio has been improved by more than two times.
O 16G and 28G backboards - support various transceivers
O Medium Speed Class Supports 2666Mb/s DDR4
Reducing BOM costs
O 12.5Gb/s transceiver with the lowest speed equal pole
O. The integration of VCXO and fPLL can reduce the cost of clock components
Reduced total power consumption
O. Power consumption is reduced by 60% compared with 7 series of FPGAs
O. Voltage scaling options support high performance and low power consumption
O. Using compact logic unit encapsulation to reduce dynamic power consumption
Increased design productivity
O Collaborative optimization with Vivado Design Suite to accelerate design convergence
Application of Smart Connect Technology for Intelligent IP Integration
112 MHz Point-to-Point MWR Modem and Data Packet Processing
_1GHz eBand Modem and Data Packet Processing
XC4VFX60-11FFG672C
XC4VFX60-11FFG1152C
XC4VFX60-10FFG672C
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XC4VFX40-11FFG672C
XC4VFX40-11FFG1152C
XC4VFX40-10FFG1152C
XC4VFX20-11FFG672C
XC4VFX20-10FFG672C
XC4VFX140-10FFG1517C
XC4VFX12-11SFG363C
XC4VFX12-11FFG668C
XC4VFX12-11FF668C
XC4VFX12-10SFG363C
XC4VFX12-10FFG668C
XC4VFX100-11FFG1517C
XC4VFX100-11FFG1152C
XC4VFX100-10FFG1517C
XC4VFX100-10FFG1152C
XC2V3000-5FGG676C
XC2V3000-4FGG676C
XC2V250-5FGG456C
XC2V250-5FGG256C
XC2V250-4FGG456C
XC2V250-4FGG256C
XCVU065-2FVLF1517I
XCVU065-3FFVC1517E
XCVU065-H1FFVC1517E
XCVU080-1FFVB2104I
XCVU080-2FFVA2104I
XCVU080-2FFVC1517E
XCVU080-2FFVD1517E
XCVU080-3FFVA2104E
XCVU080-3FFVB2104E
XCVU080-H1FFVA2104E
XCVU080-H1FFVB1760E
XCVU080-H1FFVB2104E
XCVU080-H1FFVC1517E
XCVU080-H1FFVD1517E
XCVU095-1FFVA2104I
XCVU095-1FFVB1760C
XCVU095-1FFVC2104I
XCVU095-1FFVD1517C
XCVU095-2FFVA2104I
XCVU095-2FFVB2104I
XCVU095-2FFVC2104E
XCVU095-2FFVD1517I
XCVU095-2FFVD1924E
XCVU095-2FFVE1924I
XCVU095-3FFVC1517E
XCVU095-3FFVC2104E
XCVU125-1FLVA2104I
XCVU125-1FLVB1760I
XCVU125-1FLVD1517I
XCVU125-2FLVA2104E
XCVU125-2FLVB1760I
XCVU125-2FLVB2104E
XCVU125-2FLVB2104I
XCVU125-H1FLVB2104E
XCVU125-H1FLVD1517E
XCVU13P-1FHGB2104I
XCVU13P-2FHGB2104I
XCVU13P-FHGB2104I
XCVU160-1FLGB2104I
XCVU160-1FLGC2104I
XCVU160-2FLGB2104E
XCVU160-2FLGB2104I
XCVU160-2FLGC2104E
XCVU160-2FLGC2104I
XCVU160-3FLGB2104E
XCVU160-3FLGC2104E
XCVU160-H1FLGB2104E
XCVU160-H1FLGC2104E
XCVU190-1FLGA2577I
XCVU190-1FLGB2104I
XCVU190-1FLGC2104I
XCVU190-2FLGA2577E
XCVU190-2FLGA2577I
XCVU190-2FLGB2104E
XCVU190-2FLGB2104I
