1、Kintex UltraScale+ 产品优势 例如：XCKU9P-L1FFVE900I
KXilinx Kintex® UltraScale+™现场可编程阵列具有多种功率选项，可在所需的系统性能和极低功耗之间实现最佳平衡。FPGA是半导体器件，基于通过可编程互连系统连接的可配置逻辑块 (CLB) 矩阵。Kintex UltraScale+器件是数据包处理和DSP密集型功能的理想选择，并适用于从无线MIMO技术到Nx100G网络和数据中心等各种应用。
特性
可编程系统集成
高达1.2M系统逻辑单元
适用于片上存储器集成的UltraRAM
o 集成100G以太网MAC，支持RS-FEC及150G Interlaken内核
• 提升系统性能
o 6.3 TeraMAC DSP计算性能
o 与Kintex-7 FPGA相比，系统级性能功耗比提升2倍多
o 16G和28G背板 - 支持各种收发器
o 中等速度等级可支持2666Mb/s DDR4
• 降低了BOM成本
o 最低速度等极的12.5Gb/s收发器
o VCXO与fPLL（分频锁相环）的集成可降低时钟元件成本
• 降低了总功耗
o 与7系列FPGA相比，功耗降低60%
o 电压缩放选项支持高性能与低功耗
o 采用紧密型逻辑单元封装，降低了动态功耗
• 提高了设计生产力
o 与Vivado Design Suite协同优化，加快设计收敛
适用于智能IP集成的SmartConnect技术应用
·112MHz点对点MWR调制解调器与数据包处理
·1GHz eBand调制解调器与数据包处理
1. Kintex UltraScale + product advantages such as: XCKU9P-L1FFVE900I
K Xilinx Kintex < UltraScale+} Field Programmable Array (FPA) has a variety of power options, which can achieve the best balance between the required system performance and very low power consumption. The FPGA is a semiconductor device based on a configurable logic block (CLB) matrix connected through a programmable interconnection system. Kintex UltraScale + devices are ideal for data packet processing and DSP-intensive functions, and are suitable for applications ranging from wireless MIMO technology to Nx100G network and data center.
Characteristic
Programmable System Integration
Up to 1.2M System Logic Unit
UltraRAM for on-chip memory integrationO Integrating 100G Ethernet MAC to support RS-FEC and 150G Interlaken Kernel
Improving system performance
O.3 TeraMAC DSP Computing Performance
O. Compared with Kintex-7 FPGA, the system-level performance-power ratio has been improved by more than two times.
O 16G and 28G backboards - support various transceivers
O Medium Speed Class Supports 2666Mb/s DDR4
Reducing BOM costs
O 12.5Gb/s transceiver with the lowest speed equal pole
O. The integration of VCXO and fPLL can reduce the cost of clock components
Reduced total power consumption
O. Power consumption is reduced by 60% compared with 7 series of FPGAs
O. Voltage scaling options support high performance and low power consumption
O. Using compact logic unit encapsulation to reduce dynamic power consumption
Increased design productivity
O Collaborative optimization with Vivado Design Suite to accelerate design convergence
Application of Smart Connect Technology for Intelligent IP Integration
112 MHz Point-to-Point MWR Modem and Data Packet Processing
_1GHz eBand Modem and Data Packet Processing
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